SLUSCZ6A January 2018 – May 2021 BQ25123
PRODUCTION DATA
The die junction temperature, TJ, can be estimated based on the expected board performance using Equation 6.
The RθJA is largely driven by the board layout. For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report SPRA953. Under typical conditions, the time spent in this state is short.