SLUSCZ6A January 2018 – May 2021 BQ25123
PRODUCTION DATA
THERMAL METRIC(1) | BQ25123 | UNIT | |
---|---|---|---|
YFP (DSBGA) | |||
25 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 60 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 0.3 | °C/W |
RθJB | Junction-to-board thermal resistance | 12 | °C/W |
ψJT | Junction-to-top characterization parameter | 1.2 | °C/W |
ψJB | Junction-to-board characterization parameter | 12 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |