SLUSDY5 June   2022 BQ25172

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Power Up from Input Source
        1. 7.3.1.1 ISET Pin Detection
        2. 7.3.1.2 TMR Pin Detection
        3. 7.3.1.3 VSET Pin Detection
        4. 7.3.1.4 Charger Power Up
      2. 7.3.2 Battery Charging Features
        1. 7.3.2.1 NiMH Battery Charging Profile
        2. 7.3.2.2 Charging Safety Timers
        3. 7.3.2.3 Battery Cold, Hot Temperature Qualification (TS Pin)
      3. 7.3.3 Status Outputs (STAT)
        1. 7.3.3.1 Charging Status Indicator (STAT)
      4. 7.3.4 Protection Features
        1. 7.3.4.1 Input Overvoltage Protection (VIN OVP)
        2. 7.3.4.2 Output Overvoltage Protection (BAT OVP)
        3. 7.3.4.3 Output Overcurrent Protection (BAT OCP)
        4. 7.3.4.4 Thermal Regulation and Thermal Shutdown (TREG and TSHUT)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown or Undervoltage Lockout (UVLO)
      2. 7.4.2 Sleep Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 Standby Mode
      4. 7.4.4 Fault Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 NiMH Charger Design Example
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) BQ25172 UNIT
DSG(WSON)
8 PINS
RθJA Junction-to-ambient thermal resistance (JEDEC(1)) 75.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 93.4 °C/W
RθJB Junction-to-board thermal resistance 41.8 °C/W
ΨJT Junction-to-top characterization parameter 3.8 °C/W
ΨJB Junction-to-board characterization parameter 41.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 17.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.