SLUSF40 October   2024 BQ25190

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Battery Charging Process
        1. 7.1.1.1 Trickle Charge
        2. 7.1.1.2 Precharge
        3. 7.1.1.3 Fast Charge
        4. 7.1.1.4 Termination
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Based Dynamic Power Management (VINDPM)
      2. 7.3.2  Dynamic Power Path Management Mode (DPPM)
      3. 7.3.3  Battery Supplement Mode
      4. 7.3.4  Sleep Mode
      5. 7.3.5  SYS Power Control
        1. 7.3.5.1 SYS Pulldown Control
      6. 7.3.6  SYS Regulation
      7. 7.3.7  ILIM Control
      8. 7.3.8  Protection Mechanisms
        1. 7.3.8.1  Input Overvoltage Protection
        2. 7.3.8.2  System Short Protection
        3. 7.3.8.3  Battery Depletion Protection
          1. 7.3.8.3.1 Battery Undervoltage Lockout
        4. 7.3.8.4  Battery Overcurrent Protection
        5. 7.3.8.5  Safety Timer and Watchdog Timer
        6. 7.3.8.6  Buck Overcurrent Protection
        7. 7.3.8.7  LDO Overcurrent Protection
        8. 7.3.8.8  Buck-Boost Overcurrent Protection
        9. 7.3.8.9  Buck-Boost Output Short-Circuit Protection
        10. 7.3.8.10 Buck/Buck-Boost/LDO Undervoltage Lockout
        11. 7.3.8.11 Sequence Undervoltage Lockout
        12. 7.3.8.12 Thermal Protection and Thermal Regulation
      9. 7.3.9  Integrated 12-Bit ADC for Monitoring
        1. 7.3.9.1 ADC Programmable Comparators
      10. 7.3.10 Pushbutton Wake and Reset Input
        1. 7.3.10.1 Pushbutton Short Button Press or Wake Functions
        2. 7.3.10.2 Pushbutton Long Button Press Functions
      11. 7.3.11 VIN Pulse Detection for Hardware Reset
      12. 7.3.12 15-Second VIN Watchdog for Hardware Reset
      13. 7.3.13 Hardware Reset
      14. 7.3.14 Software Reset
      15. 7.3.15 Interrupt to Host (INT)
      16. 7.3.16 External NTC Monitoring (TS)
        1. 7.3.16.1 TS Thresholds
      17. 7.3.17 Power Rail Power Sequence
        1. 7.3.17.1 Power-Up Sequence
        2. 7.3.17.2 Power-Down Sequence
      18. 7.3.18 Integrated Buck Converter (Buck)
      19. 7.3.19 Integrated Buck-Boost Converter (Buck-boost)
      20. 7.3.20 Integrated LDOs (LDO1/LDO2)
      21. 7.3.21 Multi-Function GPIOs
        1. 7.3.21.1 GPIO1 Functions
        2. 7.3.21.2 GPIO2 Functions
        3. 7.3.21.3 GPIO3 Functions
        4. 7.3.21.4 GPIO4 Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Ship Mode
        1. 7.4.1.1 LDO1-ON Ship Mode
      2. 7.4.2 Battery Mode
      3. 7.4.3 Adapter Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 START and STOP Conditions
        3. 7.5.1.3 Byte Format
        4. 7.5.1.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 7.5.1.5 Target Address and Data Direction Bit
        6. 7.5.1.6 Single Write and Read
        7. 7.5.1.7 Multi-Write and Multi-Read
    6. 7.6 Register Maps
      1. 7.6.1 BQ25190 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor Selection
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Recommended Passive Components
      3. 8.2.3 Application Performance Plots
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBG|30
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.17.2 Power-Down Sequence

Power-down sequence is implemented when SYS powers down due to a SYS power down condition, which can be Ship mode entry, HW_RESET, or SYS set to pulldown mode (SYS_MODE set to 11). Figure 7-10 shows the power-down sequence timing. The power-down sequence is from SYS power down condition being met to SYS being powered down.

BQ25190 Power-Down Sequence Timing Figure 7-10 Power-Down Sequence Timing

With a SYS power down condition, SEQUENCE_PG bit is set to 0 immediately. tSEQ_DELAY after SEQUENCE_PG set to 0, the sequence power rails are disabled in the order of "d", "c", "b", "a". If GPIOs are configured to be sequencer outputs, they will apply the corresponding pull-low at "d", "c", "b", or "a" to disable external loads or power rails. The individual mode power rails are disabled all at "d" (if not already disabled). tSEQ_DELAY after "a", the input FET and battery FET are turned off and then, SYS is pulled to GND. If no integrated power rail is in sequence mode and no GPIO is configured as sequencer output, when a SYS power down request is received, then all individual mode power rails are disabled at "d". After "a", the input FET and battery FET are turned off. Then, SYS is pulled to GND.