SLUSF40 October   2024 BQ25190

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Battery Charging Process
        1. 7.1.1.1 Trickle Charge
        2. 7.1.1.2 Precharge
        3. 7.1.1.3 Fast Charge
        4. 7.1.1.4 Termination
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Based Dynamic Power Management (VINDPM)
      2. 7.3.2  Dynamic Power Path Management Mode (DPPM)
      3. 7.3.3  Battery Supplement Mode
      4. 7.3.4  Sleep Mode
      5. 7.3.5  SYS Power Control
        1. 7.3.5.1 SYS Pulldown Control
      6. 7.3.6  SYS Regulation
      7. 7.3.7  ILIM Control
      8. 7.3.8  Protection Mechanisms
        1. 7.3.8.1  Input Overvoltage Protection
        2. 7.3.8.2  System Short Protection
        3. 7.3.8.3  Battery Depletion Protection
          1. 7.3.8.3.1 Battery Undervoltage Lockout
        4. 7.3.8.4  Battery Overcurrent Protection
        5. 7.3.8.5  Safety Timer and Watchdog Timer
        6. 7.3.8.6  Buck Overcurrent Protection
        7. 7.3.8.7  LDO Overcurrent Protection
        8. 7.3.8.8  Buck-Boost Overcurrent Protection
        9. 7.3.8.9  Buck-Boost Output Short-Circuit Protection
        10. 7.3.8.10 Buck/Buck-Boost/LDO Undervoltage Lockout
        11. 7.3.8.11 Sequence Undervoltage Lockout
        12. 7.3.8.12 Thermal Protection and Thermal Regulation
      9. 7.3.9  Integrated 12-Bit ADC for Monitoring
        1. 7.3.9.1 ADC Programmable Comparators
      10. 7.3.10 Pushbutton Wake and Reset Input
        1. 7.3.10.1 Pushbutton Short Button Press or Wake Functions
        2. 7.3.10.2 Pushbutton Long Button Press Functions
      11. 7.3.11 VIN Pulse Detection for Hardware Reset
      12. 7.3.12 15-Second VIN Watchdog for Hardware Reset
      13. 7.3.13 Hardware Reset
      14. 7.3.14 Software Reset
      15. 7.3.15 Interrupt to Host (INT)
      16. 7.3.16 External NTC Monitoring (TS)
        1. 7.3.16.1 TS Thresholds
      17. 7.3.17 Power Rail Power Sequence
        1. 7.3.17.1 Power-Up Sequence
        2. 7.3.17.2 Power-Down Sequence
      18. 7.3.18 Integrated Buck Converter (Buck)
      19. 7.3.19 Integrated Buck-Boost Converter (Buck-boost)
      20. 7.3.20 Integrated LDOs (LDO1/LDO2)
      21. 7.3.21 Multi-Function GPIOs
        1. 7.3.21.1 GPIO1 Functions
        2. 7.3.21.2 GPIO2 Functions
        3. 7.3.21.3 GPIO3 Functions
        4. 7.3.21.4 GPIO4 Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Ship Mode
        1. 7.4.1.1 LDO1-ON Ship Mode
      2. 7.4.2 Battery Mode
      3. 7.4.3 Adapter Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 START and STOP Conditions
        3. 7.5.1.3 Byte Format
        4. 7.5.1.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 7.5.1.5 Target Address and Data Direction Bit
        6. 7.5.1.6 Single Write and Read
        7. 7.5.1.7 Multi-Write and Multi-Read
    6. 7.6 Register Maps
      1. 7.6.1 BQ25190 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor Selection
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Recommended Passive Components
      3. 8.2.3 Application Performance Plots
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBG|30
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.21.4 GPIO4 Functions

GPIO4 can be configured to function as LDO1 EN pin, open-drain output, push-pull output, sequencer output, level-sensitive input, positive-edge/negative-edge trigger input based on different I2C settings.

To set GPIO4 as the LDO1 EN pin, LDO1_EN_SET should be set to b110 and GPIO4_CONFIG needs to be set to b1000.

When GPIO4 is configured to be VSEL2 pin when GPIO3 isconfigured to be VSEL1 pin, both GPIO3 and GPIO4's High/Low states are read to determine the which voltage setting to be used for Buck.

If GPIO4 is set to be in forced open-drain high state, it is in a HIGH-Z state. If GPIO4 is set to be in forced low state, it is pulled down to GND. If GPIO4 is set to be in forced push-pull high state, it is pulled up to VPU.

If GPIO4 is set to operate as a sequencer output, it is pulled up to VPU or pulled down to GND at the corresponding time instances during power-up/power-down sequence.

If GPIO4 is configured to be in input mode, its current state is readable with the GPIO4_STAT bit. As a positive-edge/negative-edge trigger input, the GPIO4_FLAG will be set when a trigger event happens and a 128μs pulse is sent through the INT pin to notify the host.

If GPIO4_CONFIG is set to b1100/b1101/b1110/b1111, GPIO4 is operating as a open-drain PWM output which is pulled low for 20%/40%/60%/80% duty ratio at fGPIO4_PWM.