SLUSF40 October   2024 BQ25190

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Battery Charging Process
        1. 7.1.1.1 Trickle Charge
        2. 7.1.1.2 Precharge
        3. 7.1.1.3 Fast Charge
        4. 7.1.1.4 Termination
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Based Dynamic Power Management (VINDPM)
      2. 7.3.2  Dynamic Power Path Management Mode (DPPM)
      3. 7.3.3  Battery Supplement Mode
      4. 7.3.4  Sleep Mode
      5. 7.3.5  SYS Power Control
        1. 7.3.5.1 SYS Pulldown Control
      6. 7.3.6  SYS Regulation
      7. 7.3.7  ILIM Control
      8. 7.3.8  Protection Mechanisms
        1. 7.3.8.1  Input Overvoltage Protection
        2. 7.3.8.2  System Short Protection
        3. 7.3.8.3  Battery Depletion Protection
          1. 7.3.8.3.1 Battery Undervoltage Lockout
        4. 7.3.8.4  Battery Overcurrent Protection
        5. 7.3.8.5  Safety Timer and Watchdog Timer
        6. 7.3.8.6  Buck Overcurrent Protection
        7. 7.3.8.7  LDO Overcurrent Protection
        8. 7.3.8.8  Buck-Boost Overcurrent Protection
        9. 7.3.8.9  Buck-Boost Output Short-Circuit Protection
        10. 7.3.8.10 Buck/Buck-Boost/LDO Undervoltage Lockout
        11. 7.3.8.11 Sequence Undervoltage Lockout
        12. 7.3.8.12 Thermal Protection and Thermal Regulation
      9. 7.3.9  Integrated 12-Bit ADC for Monitoring
        1. 7.3.9.1 ADC Programmable Comparators
      10. 7.3.10 Pushbutton Wake and Reset Input
        1. 7.3.10.1 Pushbutton Short Button Press or Wake Functions
        2. 7.3.10.2 Pushbutton Long Button Press Functions
      11. 7.3.11 VIN Pulse Detection for Hardware Reset
      12. 7.3.12 15-Second VIN Watchdog for Hardware Reset
      13. 7.3.13 Hardware Reset
      14. 7.3.14 Software Reset
      15. 7.3.15 Interrupt to Host (INT)
      16. 7.3.16 External NTC Monitoring (TS)
        1. 7.3.16.1 TS Thresholds
      17. 7.3.17 Power Rail Power Sequence
        1. 7.3.17.1 Power-Up Sequence
        2. 7.3.17.2 Power-Down Sequence
      18. 7.3.18 Integrated Buck Converter (Buck)
      19. 7.3.19 Integrated Buck-Boost Converter (Buck-boost)
      20. 7.3.20 Integrated LDOs (LDO1/LDO2)
      21. 7.3.21 Multi-Function GPIOs
        1. 7.3.21.1 GPIO1 Functions
        2. 7.3.21.2 GPIO2 Functions
        3. 7.3.21.3 GPIO3 Functions
        4. 7.3.21.4 GPIO4 Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Ship Mode
        1. 7.4.1.1 LDO1-ON Ship Mode
      2. 7.4.2 Battery Mode
      3. 7.4.3 Adapter Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 START and STOP Conditions
        3. 7.5.1.3 Byte Format
        4. 7.5.1.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 7.5.1.5 Target Address and Data Direction Bit
        6. 7.5.1.6 Single Write and Read
        7. 7.5.1.7 Multi-Write and Multi-Read
    6. 7.6 Register Maps
      1. 7.6.1 BQ25190 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Capacitor Selection
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Recommended Passive Components
      3. 8.2.3 Application Performance Plots
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBG|30
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

BQ25190 BQ25190 YBG Package 30-Pin WCSP (Top View) Figure 5-1 BQ25190 YBG Package 30-Pin WCSP (Top View)
Table 5-1 Pin Functions
PINI/O(1)DESCRIPTION
NAMENO.

IN

E5

P

DC input power supply. IN is connected to the external DC supply. Bypass IN to GND with at least 1 μF of capacitance using a ceramic capacitor.

SYS

A5, D5, F5

P

Regulated system output. Connect ceramic capatitors respectivelly as suggested in Section 8.2.2.2 as close to the SYS and GND pins as possible.

BAT

C5

P

Battery Connection. Connect to the positive terminal of the battery. Bypass BAT to GND with at least 1 μF of ceramic capacitance

GND

A1, B5

G

Ground connection. Connect to the ground plane of the circuit
CE D2 I Charge enable. Drive CE low or leave floating to enable charging when VIN is valid. Drive CE high to disable charge. CE has no effect when VIN is not present.

SCL

D1

I

I2C interface clock. Connect SCL to the logic rail through a 10 kΩ resistor.

SDA

E1

I/O

 I2C interface data. Connect SDA to the logic rail through a 10 kΩ resistor.

INT

B3

O

INT is an open-drain output that signals fault interrupts. When a fault occurs, a 128 μs active low pulse is sent out as an interrupt for the host. INT is enabled/disabled using the MASK_INT bit in the control register. Can be pulled up to 1- 20 kΩ resistor. Typical pull up voltage = 1.8V.

VPU

C3

 I GPIO push-pull mode Pull-up Voltage Pin. Connect VPU to the voltage to be used for the GPIO pins' push-pull mode functions. The pin can be left floating if GPIO pins' push-pull mode functions are not used.

GPIO1

D3

I/O

General-purpose input/output pin 1

GPIO2

D4

I/OGeneral-purpose input/output pin 2

GPIO3

E3

I/OGeneral-purpose input/output pin 3

GPIO4

E4

I/OGeneral-purpose input/output pin 4

BKOUT

A2

I

Output voltage sense pin for the internal feedback divider network of Buck. It also connects the output discharge circuit. Connect this pin to the Buck output capacitor with a short trace.

BBOUT

F1

P

Output voltage sense pin for the internal feedback divider network of Buck-boost. It also connects the output discharge circuit. Connect this pin to the Buck-boost output capacitor with a short trace.

BKSW

A4

P

Buck switch node. Connect the power inductor to this pin.

BBSW1

F4

P

Buck-boost switch node. Connect the power inductor to this pin.

BBSW2 F2 P

Buck-boost switch node. Connect the power inductor to this pin.

BKGND

A3

G

Power ground of Buck. Connect this pin to the ground plane.

BBGND

F3

G

Power ground of Buck-boost. Connect this pin to the ground plane.

MR

E2

I

Manual reset input. MR is a push-button input that must be held low for greater than tRESET to assert the reset output. If MR is pressed for a shorter period, there are two programmable timer events, tWAKE1 and tWAKE2, that trigger an interrupt to the host. The MR input can also be used to bring the device out of Ship mode.

TS

B4

I

Battery pack NTC monitor. Connect TS to a 10-kΩ NTC thermistor in parallel to a 10-kΩ resistor. If TS function is not to be used, connect a 5-kΩ resistor from TS to ground.

LSLDO1

B1

P

Output pin of LDO1. Connect the output capacitor from this pin to the ground plain.

LSLDO2

C1

P

Output pin of LDO2. Connect the output capacitor from this pin to the ground plain.

ADCIN

C4

I

Input channel to the ADC.

VINLS1

B2

P

Input pin of LDO1. Connect the intput capacitor from this pin to the ground plain.

VINLS2

C2

P

Input pin of LDO2. Connect the intput capacitor from this pin to the ground plain.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.