SLUSBH2G March   2013  – March 2019

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Schematic
      2.      Charger Efficiency vs Input Voltage
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Maximum Power Point Tracking
      2. 7.3.2 Battery Undervoltage Protection
      3. 7.3.3 Battery Overvoltage Protection
      4. 7.3.4 Battery Voltage within Operating Range (VBAT_OK Output)
      5. 7.3.5 Storage Element / Battery Management
      6. 7.3.6 Programming OUT Regulation Voltage
      7. 7.3.7 Step Down (Buck) Converter
      8. 7.3.8 Nano-Power Management and Efficiency
    4. 7.4 Device Functional Modes
      1. 7.4.1 Main Boost Charger Disabled (Ship Mode) - (VSTOR > VSTOR_CHGEN and EN = HIGH)
      2. 7.4.2 Cold-Start Operation (VSTOR < VSTOR_CHGEN, VIN_DC > VIN(CS) and PIN > PIN(CS), EN = don't care)
      3. 7.4.3 Main Boost Charger Enabled (VSTOR > VSTOR_CHGEN and EN = LOW )
        1. 7.4.3.1 Buck Converter Enabled (VSTOR > VBAT_UV, EN = LOW and VOUT_EN = HIGH )
      4. 7.4.4 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Energy Harvester Selection
      2. 8.1.2 Storage Element Selection
      3. 8.1.3 Inductor Selection
        1. 8.1.3.1 Boost Charger Inductor Selection
        2. 8.1.3.2 Buck Converter Inductor Selection
      4. 8.1.4 Capacitor Selection
        1. 8.1.4.1 VREF_SAMP Capacitance
        2. 8.1.4.2 VIN_DC Capacitance
        3. 8.1.4.3 VSTOR Capacitance
        4. 8.1.4.4 VOUT Capacitance
        5. 8.1.4.5 Additional Capacitance on VSTOR or VBAT
    2. 8.2 Typical Applications
      1. 8.2.1 Solar Application Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 TEG Application Circuit
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Piezoelectric Application Circuit
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (December 2018) to G Revision

  • Changed From: "330 mV typical,.." To: "600 mV typical,.." in the second paragraph of the Overview sectionGo
  • Changed Figure 21Go
  • Changed From: "VIN(CS) = 330 mV typical." To: "VIN(CS) = 600 mV typical." in the last paragraph of the Cold-Start Operation sectionGo

Changes from E Revision (March 2015) to F Revision

  • Changed Feature From: Cold-Start Voltage: VIN ≥ 330 mV (Typical) To: Cold-Start Voltage: VIN ≥ 600 mVGo
  • Changed the RGR Package appearanceGo
  • Increased VIN(CS) From: TYP = 330 mV and MAX = 450 mV To: TYP = 600 mV and MAX = 700 mV in Electrical Characteristics tableGo

Changes from D Revision (December 2014) to E Revision

Changes from C Revision (December 2013) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from B Revision (September 2013) to C Revision

  • Changed Feature: Continuous Energy Harvesting From Input Sources as low as 120 mV To: Continuous Energy Harvesting From Input Sources as low as 100 mVGo
  • Changed Feature From: High Efficiency up to 98% To: High Efficiency up to 93% Go
  • Changed text in the Description From: can continue to harvest energy down to VIN = 120 mV. To: can continue to harvest energy down to VIN = 100 mV. Go
  • Changed Peak Input Power n the Absolute Maximum Ratings table From: MAX = 400 mW To: MAX = 510 mWGo
  • Changed VIN(DC) in the Recommended Operating Conditions table From: MIN = 0.12 V MAX = 4 V To: MIN = 0.1 V MAX = 5.1 VGo
  • Changed VIN(DC) in the Electrical Characteristics table From: MIN = 120 mV MAX = 4000 mV To: MIN = 100 mV MAX = 5100 mVGo
  • Changed PIN in the Electrical Characteristics table From: MAX = 400 mW To: MAX = 510 mWGo
  • Added VDELTA, VBAT_OV - VIN(DC to the ELECTRICAL CHARACTERISTICS tableGo
  • Changed VOUT_EN(H) From: VSTOR - 0.2 To: VSTOR - 0.4 in the ELECTRICAL CHARACTERISTICS tableGo

Changes from A Revision (September 2013) to B Revision

Changes from * Revision (March 2013) to A Revision

  • Changed the data sheet from a Product Brief to Production dataGo