SLUSEB9B december   2020  – july 2023 BQ25672

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Device Power-On-Reset
      2. 8.3.2  PROG Pin Configuration
      3. 8.3.3  Device Power Up from Battery without Input Source
      4. 8.3.4  Device Power Up from Input Source
        1. 8.3.4.1 Power Up REGN LDO
        2. 8.3.4.2 Poor Source Qualification
        3. 8.3.4.3 ILIM_HIZ Pin
        4. 8.3.4.4 Default VINDPM Setting
        5. 8.3.4.5 Input Source Type Detection
          1. 8.3.4.5.1 D+/D– Detection Sets Input Current Limit
          2. 8.3.4.5.2 HVDCP Detection Procedure
          3. 8.3.4.5.3 Connector Fault Detection
      5. 8.3.5  Dual-Input Power Mux
        1. 8.3.5.1 VBUS Input Only
        2. 8.3.5.2 One ACFET-RBFET
        3. 8.3.5.3 Two ACFETs-RBFETs
      6. 8.3.6  Buck Converter Operation
        1. 8.3.6.1 Force Input Current Limit Detection
        2. 8.3.6.2 Input Current Optimizer (ICO)
        3. 8.3.6.3 Maximum Power Point Tracking for Small PV Panel
        4. 8.3.6.4 Pulse Frequency Modulation (PFM)
        5. 8.3.6.5 Device HIZ State
      7. 8.3.7  USB On-The-Go (OTG)
        1. 8.3.7.1 OTG Mode to Power External Devices
      8. 8.3.8  Power Path Management
        1. 8.3.8.1 Narrow Voltage DC Architecture
        2. 8.3.8.2 Dynamic Power Management
      9. 8.3.9  Battery Charging Management
        1. 8.3.9.1 Autonomous Charging Cycle
        2. 8.3.9.2 Battery Charging Profile
        3. 8.3.9.3 Charging Termination
        4. 8.3.9.4 Charging Safety Timer
        5. 8.3.9.5 Thermistor Qualification
          1. 8.3.9.5.1 JEITA Guideline Compliance in Charge Mode
          2. 8.3.9.5.2 Cold/Hot Temperature Window in OTG Mode
      10. 8.3.10 Integrated 16-Bit ADC for Monitoring
      11. 8.3.11 Status Outputs ( STAT, and INT)
        1. 8.3.11.1 Charging Status Indicator (STAT Pin)
        2. 8.3.11.2 Interrupt to Host ( INT)
      12. 8.3.12 Ship FET Control
        1. 8.3.12.1 Shutdown Mode
        2. 8.3.12.2 Ship Mode
        3. 8.3.12.3 System Power Reset
      13. 8.3.13 Protections
        1. 8.3.13.1 Voltage and Current Monitoring
          1. 8.3.13.1.1  VAC Over-voltage Protection (VAC_OVP)
          2. 8.3.13.1.2  VBUS Over-voltage Protection (VBUS_OVP)
          3. 8.3.13.1.3  VBUS Under-voltage Protection (POORSRC)
          4. 8.3.13.1.4  System Over-voltage Protection (VSYS_OVP)
          5. 8.3.13.1.5  System Short Protection (VSYS_SHORT)
          6. 8.3.13.1.6  Battery Over-voltage Protection (VBAT_OVP)
          7. 8.3.13.1.7  Battery Over-current Protection (IBAT_OCP)
          8. 8.3.13.1.8  Input Over-current Protection (IBUS_OCP)
          9. 8.3.13.1.9  OTG Over-voltage Protection (OTG_OVP)
          10. 8.3.13.1.10 OTG Under-voltage Protection (OTG_UVP)
        2. 8.3.13.2 Thermal Regulation and Thermal Shutdown
      14. 8.3.14 Serial Interface
        1. 8.3.14.1 Data Validity
        2. 8.3.14.2 START and STOP Conditions
        3. 8.3.14.3 Byte Format
        4. 8.3.14.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 8.3.14.5 Target Address and Data Direction Bit
        6. 8.3.14.6 Single Write and Read
        7. 8.3.14.7 Multi-Write and Multi-Read
    4. 8.4 Device Functional Modes
      1. 8.4.1 Host Mode and Default Mode
      2. 8.4.2 Register Bit Reset
    5. 8.5 Register Map
      1. 8.5.1 I2C Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Input (VBUS / PMID) Capacitor
        3. 9.2.2.3 Output (VSYS) Capacitor
      3. 9.2.3 Application Curves
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.14.4 Acknowledge (ACK) and Not Acknowledge (NACK)

The ACK signaling takes place after each transmitted byte. The ACK bit allows the receiver to signal the transmitter that the byte was successfully received and another byte may be sent. All clock pulses, including the acknowledge 9th clock pulse, are generated by the controller.

The transmitter releases the SDA line during the acknowledge clock pulse so the receiver can pull the SDA line LOW and it remains stable LOW during the HIGH period of this 9th clock pulse.

A NACK is signaled when the SDA line remains HIGH during the 9th clock pulse. The controller can then generate either a STOP to abort the transfer or a repeated START to start a new transfer.