SLUSD83C june   2018  – may 2023 BQ25713 , BQ25713B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Device Comparison Table
  8. 7 Pin Configuration and Functions
  9. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Power-Up from Battery Without DC Source
      2. 9.3.2  Vmin Active Protection (VAP) when Battery only Mode
      3. 9.3.3  Power-Up From DC Source
        1. 9.3.3.1 CHRG_OK Indicator
        2. 9.3.3.2 Input Voltage and Current Limit Setup
        3. 9.3.3.3 Battery Cell Configuration
        4. 9.3.3.4 Device Hi-Z State
      4. 9.3.4  USB On-The-Go (OTG)
      5. 9.3.5  Converter Operation
        1. 9.3.5.1 Inductance Detection Through IADPT Pin
        2. 9.3.5.2 Continuous Conduction Mode (CCM)
        3. 9.3.5.3 Pulse Frequency Modulation (PFM)
      6. 9.3.6  Current and Power Monitor
        1. 9.3.6.1 High-Accuracy Current Sense Amplifier (IADPT and IBAT)
        2. 9.3.6.2 High-Accuracy Power Sense Amplifier (PSYS)
      7. 9.3.7  Input Source Dynamic Power Manage
      8. 9.3.8  Two-Level Adapter Current Limit (Peak Power Mode)
      9. 9.3.9  Processor Hot Indication
        1. 9.3.9.1 PROCHOT During Low Power Mode
        2. 9.3.9.2 PROCHOT Status
      10. 9.3.10 Device Protection
        1. 9.3.10.1 Watchdog Timer
        2. 9.3.10.2 Input Overvoltage Protection (ACOV)
        3. 9.3.10.3 Input Overcurrent Protection (ACOC)
        4. 9.3.10.4 System Overvoltage Protection (SYSOVP)
        5. 9.3.10.5 Battery Overvoltage Protection (BATOVP)
        6. 9.3.10.6 Battery Short
        7. 9.3.10.7 System Short Hiccup Mode
        8. 9.3.10.8 Thermal Shutdown (TSHUT)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Forward Mode
        1. 9.4.1.1 System Voltage Regulation with Narrow VDC Architecture
        2. 9.4.1.2 Battery Charging
      2. 9.4.2 USB On-The-Go
      3. 9.4.3 Pass Through Mode (PTM)
    5. 9.5 Programming
      1. 9.5.1 I2C Serial Interface
        1. 9.5.1.1 Data Validity
        2. 9.5.1.2 START and STOP Conditions
        3. 9.5.1.3 Byte Format
        4. 9.5.1.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 9.5.1.5 Slave Address and Data Direction Bit
        6. 9.5.1.6 Single Read and Write
        7. 9.5.1.7 Multi-Read and Multi-Write
        8. 9.5.1.8 Write 2-Byte I2C Commands
    6. 9.6 Register Map
      1. 9.6.1  Setting Charge and PROCHOT Options
        1. 9.6.1.1 ChargeOption0 Register (I2C address = 01/00h) [reset = E70Eh]
        2. 9.6.1.2 ChargeOption1 Register (I2C address = 31/30h) [reset = 0211h]
        3. 9.6.1.3 ChargeOption2 Register (I2C address = 33/32h) [reset = 02B7h]
        4. 9.6.1.4 ChargeOption3 Register (I2C address = 35/34h) [reset = 0030h]
        5. 9.6.1.5 ProchotOption0 Register (I2C address = 37/36h) [reset = 4A65h]
        6. 9.6.1.6 ProchotOption1 Register (I2C address = 39/38h) [reset = 81A0h]
        7. 9.6.1.7 ADCOption Register (I2C address = 3B/3Ah) [reset = 2000h]
      2. 9.6.2  Charge and PROCHOT Status
        1. 9.6.2.1 ChargerStatus Register (I2C address = 21/20h) [reset = 0000h]
        2. 9.6.2.2 ProchotStatus Register (I2C address = 23/22h) [reset = A800h]
      3. 9.6.3  ChargeCurrent Register (I2C address = 03/02h) [reset = 0000h]
        1. 9.6.3.1 Battery Precharge Current Clamp
      4. 9.6.4  MaxChargeVoltage Register (I2C address = 05/04h) [reset value based on CELL_BATPRESZ pin setting]
      5. 9.6.5  MinSystemVoltage Register (I2C address = 0D/0Ch) [reset value based on CELL_BATPRESZ pin setting]
        1. 9.6.5.1 System Voltage Regulation
      6. 9.6.6  Input Current and Input Voltage Registers for Dynamic Power Management
        1. 9.6.6.1 Input Current Registers
          1. 9.6.6.1.1 IIN_HOST Register With 10-mΩ Sense Resistor (I2C address = 0F/0Eh) [reset = 4100h]
          2. 9.6.6.1.2 IIN_DPM Register With 10-mΩ Sense Resistor (I2C address = 25/24h) [reset = 4100h]
          3. 9.6.6.1.3 InputVoltage Register (I2C address = 0B/0Ah) [reset = VBUS-1.28V]
      7. 9.6.7  OTGVoltage Register (I2C address = 07/06h) [reset = 0000h]
      8. 9.6.8  OTGCurrent Register (I2C address = 09/08h) [reset = 0000h]
      9. 9.6.9  ADCVBUS/PSYS Register (I2C address = 27/26h)
      10. 9.6.10 ADCIBAT Register (I2C address = 29/28h)
      11. 9.6.11 ADCIINCMPIN Register (I2C address = 2B/2Ah)
      12. 9.6.12 ADCVSYSVBAT Register (I2C address = 2D/2Ch)
      13. 9.6.13 ID Registers
        1. 9.6.13.1 ManufactureID Register (I2C address = 2Eh) [reset = 0040h]
        2. 9.6.13.2 Device ID (DeviceAddress) Register (I2C address = 2Fh) [reset = 0h]
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 ACP-ACN Input Filter
        2. 10.2.2.2 Inductor Selection
        3. 10.2.2.3 Input Capacitor
        4. 10.2.2.4 Output Capacitor
        5. 10.2.2.5 Power MOSFETs Selection
      3. 10.2.3 Application Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
      1. 12.2.1 Layout Example Reference Top View
      2. 12.2.2 Inner Layer Layout and Routing Example
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1) (2)
MINMAXUNIT
VoltageSRN, SRP, ACN, ACP, VBUS, VSYS–0.330V
SW1, SW2–230
BTST1, BTST2, HIDRV1, HIDRV2, /BATDRV–0.336
LODRV1, LODRV2 (25nS)–47
HIDRV1, HIDRV2 (25nS)–436
SW1, SW2 (25nS)–430
SDA, SCL, REGN, PSYS, CHRG_OK, OTG/VAP, CELL_BATPRESZ, ILIM_HIZ, LODRV1, LODRV2, VDDA, COMP1, COMP2, CMPIN, CMPOUT–0.37
/PROCHOT–0.35.5
IADPT, IBAT, PSYS–0.33.6
Differential VoltageBTST1-SW1, BTST2-SW2, HIDRV1-SW1, HIDRV2-SW2–0.37V
SRP-SRN, ACP-ACN–0.50.5
TemperatureJunction temperature range, TJ–40155°C
Storage temperature, Tstg–40155°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging Section of the data book for thermal limitations and considerations of packages.