SLUSEK7 September   2024 BQ25773

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics BQ2577X
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power-Up Sequence
      2. 7.3.2  MODE Pin Detection
      3. 7.3.3  REGN Regulator (REGN LDO)
      4. 7.3.4  Independent Comparator Function
      5. 7.3.5  Battery Charging Management
        1. 7.3.5.1 Autonomous Charging Cycle
        2. 7.3.5.2 Battery Charging Profile
        3. 7.3.5.3 Charging Termination
        4. 7.3.5.4 Charging Safety Timer
      6. 7.3.6  Temperature Regulation (TREG)
      7. 7.3.7  Vmin Active Protection (VAP) When Battery Only Mode
      8. 7.3.8  Two Level Battery Discharge Current Limit
      9. 7.3.9  Fast Role Swap Feature
      10. 7.3.10 CHRG_OK Indicator
      11. 7.3.11 Input and Charge Current Sensing
      12. 7.3.12 Input Current and Voltage Limit Setup
      13. 7.3.13 Battery Cell Configuration
      14. 7.3.14 Device HIZ State
      15. 7.3.15 USB On-The-Go (OTG)
      16. 7.3.16 Quasi Dual Phase Converter Operation
      17. 7.3.17 Continuous Conduction Mode (CCM)
      18. 7.3.18 Pulse Frequency Modulation (PFM)
      19. 7.3.19 Switching Frequency and Dithering Feature
      20. 7.3.20 Current and Power Monitor
        1. 7.3.20.1 High-Accuracy Current Sense Amplifier (IADPT and IBAT)
        2. 7.3.20.2 High-Accuracy Power Sense Amplifier (PSYS)
      21. 7.3.21 Input Source Dynamic Power Management
      22. 7.3.22 Integrated 16-Bit ADC for Monitoring
      23. 7.3.23 Input Current Optimizer (ICO)
      24. 7.3.24 Two-Level Adapter Current Limit (Peak Power Mode)
      25. 7.3.25 Processor Hot Indication
        1. 7.3.25.1 PROCHOT During Low Power Mode
        2. 7.3.25.2 PROCHOT Status
      26. 7.3.26 Device Protection
        1. 7.3.26.1  Watchdog Timer (WD)
        2. 7.3.26.2  Input Overvoltage Protection (ACOV)
        3. 7.3.26.3  Input Overcurrent Protection (ACOC)
        4. 7.3.26.4  System Overvoltage Protection (SYSOVP)
        5. 7.3.26.5  Battery Overvoltage Protection (BATOVP)
        6. 7.3.26.6  Battery Charge Overcurrent Protection (BATCOC)
        7. 7.3.26.7  Battery Discharge Overcurrent Protection (BATDOC)
        8. 7.3.26.8  BATFET Charge Current Clamp Protection under LDO Regulation Mode
        9. 7.3.26.9  Sleep Comparator Protection Between VBUS and ACP_A (SC_VBUSACP)
        10. 7.3.26.10 High Duty Buck Exit Comparator Protection (HDBCP)
        11. 7.3.26.11 REGN Power Good Protection (REGN_PG)
        12. 7.3.26.12 System Under Voltage Lockout (VSYS_UVP) and Hiccup Mode
        13. 7.3.26.13 OTG Mode Over Voltage Protection (OTG_OVP)
        14. 7.3.26.14 OTG Mode Under Voltage Protection (OTG_UVP)
        15. 7.3.26.15 Thermal Shutdown (TSHUT)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Forward Mode
        1. 7.4.1.1 System Voltage Regulation with Narrow VDC Architecture
        2. 7.4.1.2 Battery Charging
      2. 7.4.2 USB On-The-Go Mode
      3. 7.4.3 Pass Through Mode (PTM)-Patented Technology
      4. 7.4.4 Learn Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Interface
        1. 7.5.1.1 Timing Diagrams
        2. 7.5.1.2 Data Validity
        3. 7.5.1.3 START and STOP Conditions
        4. 7.5.1.4 Byte Format
        5. 7.5.1.5 Acknowledge (ACK) and Not Acknowledge (NACK)
        6. 7.5.1.6 Target Address and Data Direction Bit
        7. 7.5.1.7 Single Read and Write
        8. 7.5.1.8 Multi-Read and Multi-Write
        9. 7.5.1.9 Write 2-Byte I2C Commands
    6. 7.6 BQ25773 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Snubber and Filter for Voltage Spike Damping
        2. 8.2.2.2 ACP-ACN Input Filter
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Input Capacitor
        5. 8.2.2.5 Output Capacitor
        6. 8.2.2.6 Power MOSFETs Selection
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Layout Example Reference Top View
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • REE|36
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.10 CHRG_OK Indicator

CHRG_OK is an active high open drain indicator. Under forward mode when VBUS is above VVBUS_CONVEN then CHRG_OK pin behavior is summarized below:

  • Under non-latched faults ACOV/ACOC/TSHUT/BATOVP (only when charge is enabled)/BATDOC/REGN_PG/force converter off, CHRG_OK will be pulled down for minimum pulse 256 μs. Even the fault is removed before 256 μs expire, the CHRG_OK pin should still be pulled down until 256 μs timer expires. When 256 μs timer expires, if the fault still exists then the CHRG_OK pin should be kept low.
  • Under latched faults SYSOVP/VSYS_UVP, CHRG_OK will be pulled down and latched until EC write 0b to FAULT_SYSOVP/FAULT_VSYS_UVP bits.
  • CHRG_OK pin can be also configured as interrupt source to inform host about the CHRG_STAT bits changes. To enable this, host needs to set CHRG_OK_INT bit to be 1b, then whenever there is a change in CHRG_STAT bits, CHRG_OK pin will be pulled down for 256 μs to inform the host. Note: safety timer changes the CHRG_STAT status as well when triggered, therefore when CHRG_OK_INT bit is set 1b, CHRG_OK pin is pulled down for 256 μs when safety timer triggers.

Under battery only OTG mode, if OTG_ON_CHRGOK=1b, the CHRG_OK pin should be low when converter shuts off due to faults SYSOVP/VSYS_UVP/OTG_UVP/OTG_OVP/TSHUT/BATDOC/REGN_PG/force converter off; if OTG_ON_CHRGOK=0b, the CHRG_OK pin should be always be pulled down.