SLUSFH5A May   2024  – October 2024 BQ25856-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Device Power-On-Reset
      2. 7.3.2  Device Power-Up From Battery Without Input Source
      3. 7.3.3  Device Power Up From Input Source
        1. 7.3.3.1 VAC Operating Window Programming (ACUV and ACOV)
        2. 7.3.3.2 REGN Regulator (REGN LDO)
        3. 7.3.3.3 Compensation-Free Buck-Boost Converter Operation
          1. 7.3.3.3.1 Light-Load Operation
        4. 7.3.3.4 Switching Frequency and Synchronization (FSW_SYNC)
        5. 7.3.3.5 Device HIZ Mode
      4. 7.3.4  Battery Charging Management
        1. 7.3.4.1 Autonomous Charging Cycle
          1. 7.3.4.1.1 Charge Current Programming (ICHG pin and ICHG_REG)
        2. 7.3.4.2 Li-Ion Battery Charging Profile
        3. 7.3.4.3 LiFePO4 Battery Charging Profile
        4. 7.3.4.4 Charging Termination for Li-ion and LiFePO4
        5. 7.3.4.5 Charging Safety Timer
        6. 7.3.4.6 Thermistor Qualification
          1. 7.3.4.6.1 JEITA Guideline Compliance in Charge Mode
          2. 7.3.4.6.2 Cold/Hot Temperature Window in Reverse Mode
      5. 7.3.5  Power Management
        1. 7.3.5.1 Dynamic Power Management: Input Voltage and Input Current Regulation
          1. 7.3.5.1.1 Input Current Regulation
            1. 7.3.5.1.1.1 ILIM_HIZ Pin
          2. 7.3.5.1.2 Input Voltage Regulation
      6. 7.3.6  Switching Frequency Dithering Feature
      7. 7.3.7  Reverse Mode Power Direction
        1. 7.3.7.1 Auto Reverse Mode
      8. 7.3.8  Integrated 16-Bit ADC for Monitoring
      9. 7.3.9  Status Outputs (PG, STAT1, STAT2, and INT)
        1. 7.3.9.1 Power Good Indicator (PG)
        2. 7.3.9.2 Charging Status Indicator (STAT1, STAT2 Pins)
        3. 7.3.9.3 Interrupt to Host (INT)
      10. 7.3.10 Protections
        1. 7.3.10.1 Voltage and Current Monitoring
          1. 7.3.10.1.1 VAC Over-voltage Protection (VAC_OVP)
          2. 7.3.10.1.2 VAC Under-voltage Protection (VAC_UVP)
          3. 7.3.10.1.3 Battery Over-voltage Protection (BAT_OVP)
          4. 7.3.10.1.4 Battery Over-current Protection (BAT_OCP)
          5. 7.3.10.1.5 Reverse Mode Over-voltage Protection (REV_OVP)
          6. 7.3.10.1.6 Reverse Mode Under-voltage Protection (REV_UVP)
          7. 7.3.10.1.7 DRV_SUP Under-voltage and Over-voltage Protection (DRV_OKZ)
          8. 7.3.10.1.8 REGN Under-voltage Protection (REGN_OKZ)
        2. 7.3.10.2 Thermal Shutdown (TSHUT)
      11. 7.3.11 Serial Interface
        1. 7.3.11.1 Data Validity
        2. 7.3.11.2 START and STOP Conditions
        3. 7.3.11.3 Byte Format
        4. 7.3.11.4 Acknowledge (ACK) and Not Acknowledge (NACK)
        5. 7.3.11.5 Target Address and Data Direction Bit
        6. 7.3.11.6 Single Write and Read
        7. 7.3.11.7 Multi-Write and Multi-Read
    4. 7.4 Device Functional Modes
      1. 7.4.1 Host Mode and Default Mode
      2. 7.4.2 Register Bit Reset
    5. 7.5 BQ25856-Q1 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Typical Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 ACUV / ACOV Input Voltage Operating Window Programming
          2. 8.2.1.2.2 Charge Voltage Selection
          3. 8.2.1.2.3 Switching Frequency Selection
          4. 8.2.1.2.4 Inductor Selection
          5. 8.2.1.2.5 Input (VAC) Capacitor
          6. 8.2.1.2.6 Output (VBAT) Capacitor
          7. 8.2.1.2.7 Sense Resistor (RAC_SNS and RBAT_SNS) and Current Programming
          8. 8.2.1.2.8 Power MOSFETs Selection
          9. 8.2.1.2.9 Converter Fast Transient Response
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Typical Application (4s LiFePO4 car battery configuration)
        1. 8.2.2.1 Design Requirements
      3. 8.2.3 Typical Application (Capacitor Backup)
        1. 8.2.3.1 Design Requirements
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RRV|36
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VAC Input voltage 4.4 70 V
VBAT Battery voltage 0 70 V
VDRV_SUP DRV_SUP pin direct drive voltage range 4.0 12 V
FSW Switching Frequency 200 600 kHz
CVAC VAC capacitor 1 µF
CIN Buck-boost input capacitance (minimum value after derating) 80 µF
CREGN REGN capacitor (nominal value before derating) 4.7 µF
CDRV_SUP DRV_SUP capacitor (nominal value before derating) 4.7 µF
L Switched Inductor 2.2 15 µH
RDCR Inductor DC resistance 1.75 60 mΩ
RAC_SNS Input current sense resistor 0(1) 5 10 mΩ
RBAT_SNS Battery current sense resistor 5 mΩ
RICHG ICHG programming pulldown resistor 0.0(2) 100 kΩ
RILIM_HIZ ILIM_HIZ programming pulldown resistor 0.0(3) 50 kΩ
TJ Operating junction temperature(4) –40 150 °C
(1) When RAC_SNS is 0mΩ, input current limit function is disabled
(2) When RICHG is pulled to GND, the hardware charge current limit is disabled, actual charge current is controlled by the ICHG_REG register setting
(3) When RILIM_HIZ is pulled to GND, the hardware input current limit is disabled, actual input current is controlled by the IAC_DPM register setting
(4) High junction temperatures degrade operating lifetime. Operating lifetime is de-rated for junction temperature greater than 125°C