SLUSD89B February 2019 – November 2019 BQ25887
PRODUCTION DATA.
THERMAL METRIC(1) | bq25887 | UNIT | |
---|---|---|---|
RGE (VQFN) | |||
24-PIN | |||
RΘJA | Junction-to-ambient thermal resistance (JEDEC (1)) | 32.4 | °C/W |
RΘJC(top) | Junction-to-case (top) thermal resistance | 26.7 | °C/W |
RΘJB | Junction-to-board thermal resistance | 10.7 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.4 | °C/W |
ΨJB | Junction-to-board characterization parameter | 10.6 | °C/W |
RΘJC(bot) | Junction-to-case (bottom) thermal resistance | 3.7 | °C/W |