SLUSB23B October   2012  – June 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: Power-On Reset
    6. 7.6  2.5-V LDO Regulator
    7. 7.7  Integrating ADC (Coulomb Counter) Characteristics
    8. 7.8  Integrated Sense Resistor Characteristics
    9. 7.9  ADC (Temperature and Cell Measurement) Characteristics
    10. 7.10 EEPROM Memory Characteristics
    11. 7.11 Timing Requirements: I2C-Compatible Interface Communication
    12. 7.12 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fuel Gauging
      2. 8.3.2 Fuel Gauging Configurations
        1. 8.3.2.1 SOC Smoothing Feature
      3. 8.3.3 GPOUT Pin
      4. 8.3.4 Battery Detection (BIN)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
        1. 8.4.1.1 POR and INITIALIZATION Modes
        2. 8.4.1.2 CONFIG UPDATE Mode
        3. 8.4.1.3 NORMAL Mode
        4. 8.4.1.4 SLEEP Mode
        5. 8.4.1.5 HIBERNATE Mode
    5. 8.5 Programming
      1. 8.5.1 Standard Data Commands
        1. 8.5.1.1  Control(): 0x00 and 0x01
          1. 8.5.1.1.1  CONTROL_STATUS: 0x0000
          2. 8.5.1.1.2  DEVICE_TYPE: 0x0001
          3. 8.5.1.1.3  FW_VERSION: 0x0002
          4. 8.5.1.1.4  PREV_MACWRITE: 0x0007
          5. 8.5.1.1.5  CHEM_ID: 0x0008
          6. 8.5.1.1.6  BAT_INSERT: 0X000C
          7. 8.5.1.1.7  BAT_REMOVE: 0X000D
          8. 8.5.1.1.8  SET_HIBERNATE: 0x0011
          9. 8.5.1.1.9  CLEAR_HIBERNATE: 0x0012
          10. 8.5.1.1.10 SET_CFGUPDATE: 0x0013
          11. 8.5.1.1.11 SEALED: 0x0020
          12. 8.5.1.1.12 RESET: 0x0041
          13. 8.5.1.1.13 SOFT_RESET: 0x0042
        2. 8.5.1.2  Temperature( ): 0x02 and 0x03
        3. 8.5.1.3  Voltage( ): 0x04 and 0x05
        4. 8.5.1.4  Flags( ): 0x06 and 0x07
        5. 8.5.1.5  NominalAvailableCapacity( ): 0x08 and 0x09
        6. 8.5.1.6  FullAvailableCapacity( ): 0x0A and 0x0B
        7. 8.5.1.7  RemainingCapacity( ): 0x0C and 0x0D
        8. 8.5.1.8  FullChargeCapacity( ): 0x0E and 0x0F
        9. 8.5.1.9  AverageCurrent( ): 0x10 and 0x11
        10. 8.5.1.10 AveragePower( ): 0x18 and 0x19
        11. 8.5.1.11 StateOfCharge( ): 0x1C and 0x1D
        12. 8.5.1.12 IntTemperature( ): 0x1E and 0x1F
        13. 8.5.1.13 StateOfHealth( ): 0x20 and 0x21
        14. 8.5.1.14 OperationConfiguration( ): 0x3A and 0x3B
        15. 8.5.1.15 DesignCapacity( ): 0x3C and 0x3D
        16. 8.5.1.16 DebugX( ):
      2. 8.5.2 Extended Data Commands
        1. 8.5.2.1 OperationConfiguration( ): 0x3A and 0x3B
        2. 8.5.2.2 DesignCapacity( ): 0x3C and 0x3D
        3. 8.5.2.3 DataClass( ): 0x3E
        4. 8.5.2.4 DataBlock( ): 0x3F
        5. 8.5.2.5 BlockData( ): 0x40 through 0x5F
        6. 8.5.2.6 BlockDataChecksum( ): 0x60
        7. 8.5.2.7 BlockDataControl( ): 0x61
        8. 8.5.2.8 Reserved: 0x62 through 0x7F
      3. 8.5.3 Block Data Interface
        1. 8.5.3.1 Accessing Block Data
      4. 8.5.4 Access Modes
        1. 8.5.4.1 Sealing and Unsealing Data Blocks
      5. 8.5.5 Data Block Summary
      6. 8.5.6 Detecting Charge Termination
      7. 8.5.7 Communications
        1. 8.5.7.1 I2C Interface
        2. 8.5.7.2 I2C Time Out
        3. 8.5.7.3 I2C Command Waiting Time
        4. 8.5.7.4 I2C Clock Stretching
    6. 8.6 Register Maps
      1. 8.6.1 Operation Configuration (Op Config) Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 BAT/REGIN Voltage Sense Input
        2. 9.2.2.2 Integrated LDO Capacitor
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging
      1. 13.1.1 Package Dimensions

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

YZP Package
15-Pin DSBGA
bq27425-G2 bq8036_ds_pinout_slusb23.gif

Pin Functions

PIN I/O(1) DESCRIPTION
NAME NO.
BAT E2 I Cell-voltage measurement input. ADC input. Recommend 4.8 V maximum for conversion accuracy.
BIN C3 I Battery-insertion detection input. A logic high-to-low transition is detected as a battery insertion event. Recommend using a pullup resistor >1 MΩ (1.8 MΩ, typical) to VCC for reduced power consumption. An internal pullup resistor option is also available using the Operation Configuration [BI_PU_EN] register bit.
CE D2 I Chip Enable. Internal LDO is disconnected from REGIN when driven low.
GPOUT A2 O General Purpose open-drain output. May be configured as a Battery Low indicator or perform SOC interrupt (SOC_INT) function.
NC A1, B2 NA No internal connection. May be left floating.
C2, D3, E3 IO Reserved for factory use. Must be left floating for proper operation.
REGIN E1 P Regulator input. Decouple with 0.1-μF ceramic capacitor to VSS.
SCL A3 I Slave I2C serial communications clock input line for communication with system (Master). Use with 10-kΩ pullup resistor (typical).
SDA B3 I/O Slave I2C serial communications data line for communication with system (Master). Open-drain IO. Use with 10-kΩ pullup resistor (typical).
SRX B1 IA Integrated Sense Resistor and Coulomb Counter input typically connected to battery PACK– terminal. For best performance decouple with 0.1-μF ceramic capacitor to VSS.
VCC D1 P Regulator output and bq27425 processor power. Decouple with 1-μF ceramic capacitor to VSS.
VSS C1 P, IA Device ground and Integrated Sense Resistor termination.
(1) IO = Digital input/output, IA = Analog input, P = Power connection