SLUSC91G october   2015  – april 2023 BQ27426

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Supply Current
    6. 6.6  Digital Input and Output DC Characteristics
    7. 6.7  LDO Regulator, Wake-up, and Auto-Shutdown DC Characteristics
    8. 6.8  LDO Regulator, Wake-up, and Auto-Shutdown AC Characteristics
    9. 6.9  ADC (Temperature and Cell Measurement) Characteristics
    10. 6.10 Integrating ADC (Coulomb Counter) Characteristics
    11. 6.11 I2C-Compatible Interface Communication Timing Characteristics
    12. 6.12 SHUTDOWN and WAKE-UP Timing
    13. 6.13 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Communications
        1. 7.3.1.1 I2C Interface
        2. 7.3.1.2 I2C Time Out
        3. 7.3.1.3 I2C Command Waiting Time
        4. 7.3.1.4 I2C Clock Stretching
    4. 7.4 Device Functional Modes
      1. 7.4.1 SHUTDOWN Mode
      2. 7.4.2 POR and INITIALIZATION Modes
      3. 7.4.3 CONFIG UPDATE Mode
      4. 7.4.4 NORMAL Mode
      5. 7.4.5 SLEEP Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 BAT Voltage Sense Input
        2. 8.2.2.2 Integrated LDO Capacitor
        3. 8.2.2.3 Sense Resistor Selection
      3. 8.2.3 External Thermistor Support
      4. 8.2.4 Application Curves
  9. 9 Power Supply Recommendation
    1. 9.1 Power Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) BQ27426 UNIT
YZF (DSBGA)
9 PINS
RθJA Junction-to-ambient thermal resistance 64.1 °C/W
RθJCtop Junction-to-case (top) thermal resistance 59.8 °C/W
RθJB Junction-to-board thermal resistance 52.7 °C/W
ψJT Junction-to-top characterization parameter 0.3 °C/W
ψJB Junction-to-board characterization parameter 28.3 °C/W
RθJCbot Junction-to-case (bottom) thermal resistance 2.4 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics Application Report, SPRA953.