SLUSE22B February   2020  – November 2022 BQ27Z561-R2

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Current
    6. 7.6  Internal 1.8-V LDO (REG18)
    7. 7.7  I/O (PULS, INT)
    8. 7.8  Chip Enable (CE)
    9. 7.9  Internal Temperature Sensor
    10. 7.10 NTC Thermistor Measurement Support
    11. 7.11 Coulomb Counter (CC)
    12. 7.12 Analog Digital Converter (ADC)
    13. 7.13 Internal Oscillator Specifications
    14. 7.14 Voltage Reference1 (REF1)
    15. 7.15 Voltage Reference2 (REF2)
    16. 7.16 Flash Memory
    17. 7.17 I2C I/O
    18. 7.18 I2C Timing — 100 kHz
    19. 7.19 I2C Timing — 400 kHz
    20. 7.20 HDQ Timing
    21. 7.21 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  BQ27Z561-R2 Processor
      2. 8.3.2  Battery Parameter Measurements
        1. 8.3.2.1 Coulomb Counter (CC)
        2. 8.3.2.2 CC Digital Filter
        3. 8.3.2.3 ADC Multiplexer
        4. 8.3.2.4 Analog-to-Digital Converter (ADC)
        5. 8.3.2.5 Internal Temperature Sensor
        6. 8.3.2.6 External Temperature Sensor Support
      3. 8.3.3  Power Supply Control
      4. 8.3.4  Bus Communication Interface
      5. 8.3.5  Low Frequency Oscillator
      6. 8.3.6  High Frequency Oscillator
      7. 8.3.7  1.8-V Low Dropout Regulator
      8. 8.3.8  Internal Voltage References
      9. 8.3.9  Gas Gauging
      10. 8.3.10 Charge Control Features
      11. 8.3.11 Authentication
    4. 8.4 Device Functional Modes
      1. 8.4.1 Lifetime Logging Features
      2. 8.4.2 Configuration
        1. 8.4.2.1 Coulomb Counting
        2. 8.4.2.2 Cell Voltage Measurements
        3. 8.4.2.3 Auto Calibration
        4. 8.4.2.4 Temperature Measurements
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements (Default)
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Changing Design Parameters
      3. 9.2.3 Calibration Process
      4. 9.2.4 Gauging Data Updates
        1. 9.2.4.1 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.12 Analog Digital Converter (ADC)

Unless otherwise noted, characteristics noted under conditions of TA = –40℃ to 85℃
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VADC_TS_GPIO Input voltage range VFS = VREF2 –0.2 1.0 V
VFS = VREG18 × 2 –0.2 1.44 V
VBAT_MODE Battery input voltage –0.2 5.5 V
Integral nonlinearity 16-bit, best fit, –0.1 V to 0.8 × VREF2 –8.4 +8.4 LSB
Differential nonlinearity 16-bit, no missing codes 1.5 LSB
Offset error 16-bit post calibration(1), VFS = VREF2 –4.2 1.8 +4.2 LSB
Offset error drift 16-bit post calibration(1), VFS = VREF2 0.02 0.1 LSB/°C
Gain Error 16-bit, –0.1 to 0.8 × VFS –492 131 +492 LSB
Gain error drift 16-bit, –0.1 to 0.8 × VFS 2 4.5 LSB/°C
Effective input resistance 8 MΩ
t(ADC_CONV) Conversion time 11.7 ms
Effective resolution 14 15 bits
(1) Factory calibration