SLUSCY0B May   2018  – August 2019 BQ27Z561

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Supply Current
    6. 6.6  Internal 1.8-V LDO (REG18)
    7. 6.7  I/O (CE, PULS, INT)
    8. 6.8  Internal Temperature Sensor
    9. 6.9  NTC Thermistor Measurement Support
    10. 6.10 Coulomb Counter (CC)
    11. 6.11 Analog Digital Converter (ADC)
    12. 6.12 Internal Oscillator Specifications
    13. 6.13 Voltage Reference1 (REF1)
    14. 6.14 Voltage Reference2 (REF2)
    15. 6.15 Flash Memory
    16. 6.16 I2C I/O
    17. 6.17 I2C Timing — 100 kHz
    18. 6.18 I2C Timing — 400 kHz
    19. 6.19 HDQ Timing
    20. 6.20 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  BQ27Z561 Processor
      2. 7.3.2  Battery Parameter Measurements
        1. 7.3.2.1 Coulomb Counter (CC)
        2. 7.3.2.2 CC Digital Filter
        3. 7.3.2.3 ADC Multiplexer
        4. 7.3.2.4 Analog-to-Digital Converter (ADC)
        5. 7.3.2.5 Internal Temperature Sensor
        6. 7.3.2.6 External Temperature Sensor Support
      3. 7.3.3  Power Supply Control
      4. 7.3.4  Bus Communication Interface
      5. 7.3.5  Low Frequency Oscillator
      6. 7.3.6  High Frequency Oscillator
      7. 7.3.7  1.8-V Low Dropout Regulator
      8. 7.3.8  Internal Voltage References
      9. 7.3.9  Gas Gauging
      10. 7.3.10 Charge Control Features
      11. 7.3.11 Authentication
    4. 7.4 Device Functional Modes
      1. 7.4.1 Lifetime Logging Features
      2. 7.4.2 Configuration
        1. 7.4.2.1 Coulomb Counting
        2. 7.4.2.2 Cell Voltage Measurements
        3. 7.4.2.3 Auto Calibration
        4. 7.4.2.4 Temperature Measurements
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements (Default)
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Changing Design Parameters
      3. 8.2.3 Calibration Process
      4. 8.2.4 Gauging Data Updates
        1. 8.2.4.1 Application Curve
  9. 9 Power Supply Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Pin Functions

NUMBER NAME I/O DESCRIPTION
D2 BAT P(1) Battery voltage measurement input. Kelvin battery sense connection to BAT_SNS. Connect a capacitor (1 µF) between BAT and VSS. Place the capacitor close to the gauge.
D3 CE I Active high chip enable
C2 BAT_SNS AI Battery sense
A1 INT O Interrupt for voltage, temperature, and state of charge (programmable active high or low)
A2 PULS O Programmable pulse width with active high or low option
B1 TS AI Temperature input for ADC
C3 NU NU Makes no external connection
B3 SCL I/O Serial clock for I2C interface; requires external pull up when used. It can be left floating if unused.
A3 SDA/HDQ I/O Serial data for I2C interface and one-wire interface for HDQ (selectable); requires external pull up when used. It can be left floating if unused.
D1 SRP I Analog input pin connected to the internal coulomb counter peripheral for integrating a small voltage between SRP (positive side) and SRN
C1 SRN I Analog input pin connected to the internal coulomb counter peripheral for integrating a small voltage between SRP (positive side) and SRN.
B2 VSS P Device ground
(1) P = Power Connection, O = Digital Output, AI = Analog Input, I = Digital Input, I/O = Digital Input/Output, NU = Not Used