SLUSBU5U November   2013  – October 2024 BQ2961 , BQ2962

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Details
        1. 7.3.1.1 Input Sense Voltage, Vx
        2. 7.3.1.2 Output Drive, OUT
        3. 7.3.1.3 Supply Input, VDD
        4. 7.3.1.4 Regulated Supply Output, REG
      2. 7.3.2 Overvoltage Sensing for OUT
      3. 7.3.3 Regulated Output Voltage and REG_EN Pin
    4. 7.4 Device Functional Modes
      1. 7.4.1 NORMAL Mode
      2. 7.4.2 OVERVOLTAGE Mode
      3. 7.4.3 UNDERVOLTAGE Mode
      4. 7.4.4 CUSTOMER TEST MODE
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

Use the following layout guidelines:

  1. Ensure the RC filters for the Vx pins and VDD pin are placed as close as possible to the target terminal, reducing the tracing loop area.
  2. The capacitor for REG should be placed close to the device terminals.
  3. Ensure the trace connecting the fuse to the gate, source of the NFET to the Pack– is sufficient to withstand the current during a fuse blown event.