SLUSBU9I March   2014  – August 2024 BQ2970 , BQ2971 , BQ2972 , BQ2973

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1. 5.1 Pin Descriptions
      1. 5.1.1 Supply Input: BAT
      2. 5.1.2 Cell Negative Connection: VSS
      3. 5.1.3 Voltage Sense Node: V–
      4. 5.1.4 Discharge FET Gate Drive Output: DOUT
      5. 5.1.5 Charge FET Gate Drive Output: COUT
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Characteristics
    6. 6.6 Programmable Fault Detection Thresholds
    7. 6.7 Programmable Fault Detection Timer Ranges
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Timing Charts
    2. 7.2 Test Circuits
    3. 7.3 Test Circuit Diagrams
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation
      2. 8.4.2 Overcharge Status
      3. 8.4.3 Over-Discharge Status
      4. 8.4.4 Discharge Overcurrent Status (Discharge Overcurrent, Load Short-Circuit)
      5. 8.4.5 Charge Overcurrent Status
      6. 8.4.6 0V Charging Function Enabled
      7. 8.4.7 0V Charging Inhibit Function
      8. 8.4.8 Delay Circuit
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Related Documentation
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 ESD Ratings

VALUEUNIT
VESD(1)Electrostatic DischargeHuman body model (HBM), per ANSI/ESDA/JEDEC JS–001, all pins(2)±2000V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(3)±500
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges into the device.
(2) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. Pins listed as 1000V can have higher performance.
(3) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process. Pins listed as 250V can have higher performance.