SLUS928B March   2009  – July 2016

 

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
      1.      System Partitioning Diagram
  4. 4Revision History
  5. 5Pin Configuration and Functions
    1.     Pin Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. 7Detailed Description
    1. 7.1 Feature Description
      1. 7.1.1  Battery Parameter Measurements
        1. 7.1.1.1 Charge and Discharge Counting
        2. 7.1.1.2 Voltage
        3. 7.1.1.3 Voltage Calibration and Accuracy
        4. 7.1.1.4 Current
        5. 7.1.1.5 Auto Calibration
        6. 7.1.1.6 Temperature
      2. 7.1.2  Primary (1st Level) Safety Features
      3. 7.1.3  Secondary (2nd Level) Safety Features
      4. 7.1.4  Charge Control Features
      5. 7.1.5  Gas Gauging
      6. 7.1.6  Lifetime Data Logging Features
      7. 7.1.7  Authentication
      8. 7.1.8  Configuration
        1. 7.1.8.1 System Present Operation
        2. 7.1.8.2 2-, 3-, or 4-Cell Configuration
        3. 7.1.8.3 Cell Balance Control
      9. 7.1.9  Communications
        1. 7.1.9.1 SMBus On and Off State
      10. 7.1.10 SBS Commands
    2. 7.2 Device Functional Modes
      1. 7.2.1 Power Modes
  8. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.