SLUS900E December   2008  – August 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 IRQ Function
      2. 7.3.2 VBACK Switchover
      3. 7.3.3 Trickle Charge
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Interface
    6. 7.6 Register Maps
      1. 7.6.1 I2C Read After Backup Mode
      2. 7.6.2 Normal Register Descriptions
        1. 7.6.2.1  SECONDS Register (address = 0x00) [reset = 0XXXXXXb]
        2. 7.6.2.2  MINUTES Register (address = 0x01) [reset = 1XXXXXXb]
        3. 7.6.2.3  CENT_HOURS Register (address = 0x02) [reset = XXXXXXXXb]
        4. 7.6.2.4  DAY Register (address = 0x03) [reset = 00000XXXb]
        5. 7.6.2.5  DATE Register (address = 0x04) [reset = 00XXXXXXb]
        6. 7.6.2.6  MONTH Register (address = 0x05) [reset = 000XXXXXb]
        7. 7.6.2.7  YEARS Register (address = 0x06) [reset = XXXXXXXXb]
        8. 7.6.2.8  CAL_CFG1 Register (address = 0x07) [reset = 10000000b]
        9. 7.6.2.9  TCH2 Register (address = 0x08) [reset = 10010000b]
        10. 7.6.2.10 CFG2 Register (address = 0x09) [reset = 10101010b]
      3. 7.6.3 Special Function Registers
        1. 7.6.3.1 SF KEY 1 Register (address = 0x20) [reset = 00000000b]
        2. 7.6.3.2 SF KEY 2 Register (address = 0x21) [reset = 00000000b]
        3. 7.6.3.3 SFR Register (address = 0x22) [reset = 00000000b]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Reading From a Register
        2. 8.2.2.2 Leap Year Compensation
        3. 8.2.2.3 Utilizing the Backup Supply
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.