SLUSAW3D December   2014  – January 2017

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Supply Voltage
    6. 7.6  Supply Current
    7. 7.7  Power Supply Control
    8. 7.8  Low-Voltage General Purpose I/O (TSx)
    9. 7.9  High-Voltage General Purpose I/O (GPIO0, GPIO1)
    10. 7.10 AFE Power-On Reset
    11. 7.11 Internal 1.8-V LDO
    12. 7.12 Current Wake Comparator
    13. 7.13 Coulomb Counter
    14. 7.14 CC Digital Filter
    15. 7.15 ADC
    16. 7.16 ADC Digital Filter
    17. 7.17 ADC Multiplexer
    18. 7.18 Cell Balancing Support
    19. 7.19 Cell Detach Detection
    20. 7.20 Internal Temperature Sensor
    21. 7.21 NTC Thermistor Measurement Support (ADCx)
    22. 7.22 High-Frequency Oscillator
    23. 7.23 Low-Frequency Oscillator
    24. 7.24 Voltage Reference 1
    25. 7.25 Voltage Reference 2
    26. 7.26 Instruction Flash
    27. 7.27 Data Flash
    28. 7.28 Current Protection Thresholds
    29. 7.29 N-CH FET Drive (CHG, DSG)
    30. 7.30 FUSE Drive (AFEFUSE)
    31. 7.31 Battery Charger Voltage Regulation (VFB)
    32. 7.32 Battery Charger Current Sense (HSRP, HSRN)
    33. 7.33 Battery Charger Precharge Current Sense (HSRP, HSRN)
    34. 7.34 AC Adapter Fault Detect (HSRN, VCC)
    35. 7.35 Battery Charger Overcurrent Detection (V)HSRP, (V)HSRN
    36. 7.36 Battery Charger Undercurrent Detection (V)HSRP, (V)HSRN
    37. 7.37 System Operation Detection (V)HSRN
    38. 7.38 Battery Overvoltage Comparator (VFB)
    39. 7.39 Regulator (REGN)
    40. 7.40 PWM High-Side Driver (HiDRV)
    41. 7.41 PWM Low-Side Driver (LoDRV)
    42. 7.42 PWM Information
    43. 7.43 Charger Power-Up Sequence
    44. 7.44 Thermal Shutdown Comparator
    45. 7.45 SMBus High Voltage I/O
    46. 7.46 SMBus
    47. 7.47 SMBus XL
    48. 7.48 Timing Requirements
    49. 7.49 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Safety Features
      2. 8.3.2  Analog Front End (AFE) Details
        1. 8.3.2.1 Wake Up Comparator
        2. 8.3.2.2 Cell Balancing Support
        3. 8.3.2.3 FET Drive
        4. 8.3.2.4 Fuse Drive
      3. 8.3.3  Charge Controller Details
        1. 8.3.3.1 Precharge Modes
        2. 8.3.3.2 Zero-Volt Charge Support
        3. 8.3.3.3 Charge Termination
      4. 8.3.4  Fuel Gauge and Control Details
        1. 8.3.4.1 Battery Trip Point (BTP)
        2. 8.3.4.2 Lifetime Data Logging Features
      5. 8.3.5  Authentication
      6. 8.3.6  LED Display
      7. 8.3.7  Internal Temperature Sensor
      8. 8.3.8  External Temperature Sensor Support
      9. 8.3.9  High Frequency Oscillator
      10. 8.3.10 Communications
        1. 8.3.10.1 SMBus On and Off State
        2. 8.3.10.2 SBS Commands
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Input Capacitor
        3. 9.2.2.3 Output Capacitor
        4. 9.2.2.4 Power MOSFETs Selection
        5. 9.2.2.5 Input Filter Design
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Layout
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Related Documentation

For related documentation, see the bq40z60 Technical Reference Manual (SLUUA04).

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

Impedance Track, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.