SLUSFB5
June 2024
BQ41Z50
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Description (continued)
5
Pin Configuration and Functions
5.1
Pin Equivalent Diagrams
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Supply Current
6.6
Power Supply Control
6.7
Current Wake Detector
6.8
VC0, VC1, VC2, VC3, VC4, PACK
6.9
SMBD, SMBC
6.10
PRES/SHUTDN, DISP
6.11
ALERT
6.12
Coulomb Counter Digital Filter (CC1)
6.13
ADC Digital Filter
6.14
CHG, DSG High-side NFET Drivers
6.15
Precharge (PCHG) FET Drive
6.16
FUSE Drive
6.17
Internal Temperature Sensor
6.18
TS1, TS2, TS3, TS4
6.19
Flash Memory
6.20
GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6, GPIO7
6.21
Elliptical Curve Cryptography (ECC)
6.22
SMBus Interface Timing
6.23
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Primary (1st Level) Safety Features
7.3.2
Secondary (2nd Level) Safety Features
7.3.3
Charge Control Features
7.3.4
Gas Gauging
7.3.5
Lifetime Data Logging Features
7.3.6
Authentication
7.3.7
Configuration
7.3.7.1
Oscillator Function
7.3.7.2
Real Time Clock
7.3.7.3
System Present Operation
7.3.7.4
Emergency Shutdown
7.3.7.5
2-Series, 3-Series, or 4-Series Cell Configuration
7.3.7.6
Cell Balancing
7.3.7.7
LED Display
7.3.8
Battery Parameter Measurements
7.3.8.1
Charge and Discharge Counting
7.3.8.2
Voltage
7.3.8.3
Current
7.3.8.4
Temperature
7.3.8.5
Communications
7.3.8.5.1
SMBus On and Off State
7.4
Device Functional Modes
8
Applications and Implementation
8.1
Application Information
8.2
Typical Applications
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
High-Current Path
8.2.2.1.1
Protection FETs
8.2.2.1.2
Chemical Fuse
8.2.2.1.3
Lithium-Ion Cell Connections
8.2.2.1.4
Sense Resistor
8.2.2.1.5
ESD Mitigation
8.2.2.2
Gas Gauge Circuit
8.2.2.2.1
Coulomb-Counting Interface
8.2.2.2.2
Low-dropout Regulators (LDOs)
8.2.2.2.2.1
REG18
8.2.2.2.2.2
REG135
8.2.2.2.3
System Present
8.2.2.2.4
SMBus Communication
8.2.2.2.5
FUSE Circuitry
8.2.2.3
Secondary-Current Protection
8.2.2.3.1
Cell and Battery Inputs
8.2.2.3.2
External Cell Balancing
8.2.2.3.3
PACK and FET Control
8.2.2.3.4
Temperature Measurement
8.2.2.3.5
LEDs
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.1.1
Protector FET Bypass and Pack Terminal Bypass Capacitors
8.4.1.2
ESD Spark Gap
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Third-Party Products Disclaimer
9.2
Documentation Support
9.2.1
Related Documentation
9.3
Receiving Notification of Documentation Updates
9.4
Support Resources
9.5
Trademarks
9.6
Electrostatic Discharge Caution
9.7
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RSN|32
MPQF194B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slusfb5_oa
8.4
Layout