SLUSBB1B December   2012  – June 2016

 

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics Curves
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Fundamentals
      2. 7.1.2 Wireless Power Consortium (WPC)
      3. 7.1.3 Power Transfer
      4. 7.1.4 Communication
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Dynamic Power Limiting™
      2. 7.3.2  Option Select Pin
      3. 7.3.3  LED Indication Modes
      4. 7.3.4  Parasitic Metal Object Detect (PMOD) and Foreign Object Detection (FOD)
      5. 7.3.5  Shut Down via External Thermal Sensor or Trigger
      6. 7.3.6  Fault Handling and Indication
      7. 7.3.7  Power Transfer Start Signal
      8. 7.3.8  Power-On Reset
      9. 7.3.9  External Reset, RESET Pin
      10. 7.3.10 Trickle Charge and CS100
      11. 7.3.11 Current Monitoring Requirements
      12. 7.3.12 Overcurrent Protection
      13. 7.3.13 MSP430G2001 Low Power Supervisor
        1. 7.3.13.1 MSP430 Low Power Supervisor Details
      14. 7.3.14 All Unused Pins
  8. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Detailed Design Procedure
        1. 8.1.1.1 Coils and Matching Capacitors
        2. 8.1.1.2 Input Regulator
        3. 8.1.1.3 Power Train
        4. 8.1.1.4 Low Power Supervisor
        5. 8.1.1.5 Disabling Low Power Supervisor Mode
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Community Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Device and Documentation Support

10.1 Documentation Support

10.1.1 Related Documentation

10.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

10.3 Trademarks

Dynamic Power Limiting, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

10.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

10.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.