SLUSBB1B December   2012  – June 2016

 

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics Curves
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Fundamentals
      2. 7.1.2 Wireless Power Consortium (WPC)
      3. 7.1.3 Power Transfer
      4. 7.1.4 Communication
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Dynamic Power Limiting™
      2. 7.3.2  Option Select Pin
      3. 7.3.3  LED Indication Modes
      4. 7.3.4  Parasitic Metal Object Detect (PMOD) and Foreign Object Detection (FOD)
      5. 7.3.5  Shut Down via External Thermal Sensor or Trigger
      6. 7.3.6  Fault Handling and Indication
      7. 7.3.7  Power Transfer Start Signal
      8. 7.3.8  Power-On Reset
      9. 7.3.9  External Reset, RESET Pin
      10. 7.3.10 Trickle Charge and CS100
      11. 7.3.11 Current Monitoring Requirements
      12. 7.3.12 Overcurrent Protection
      13. 7.3.13 MSP430G2001 Low Power Supervisor
        1. 7.3.13.1 MSP430 Low Power Supervisor Details
      14. 7.3.14 All Unused Pins
  8. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Detailed Design Procedure
        1. 8.1.1.1 Coils and Matching Capacitors
        2. 8.1.1.2 Input Regulator
        3. 8.1.1.3 Power Train
        4. 8.1.1.4 Low Power Supervisor
        5. 8.1.1.5 Disabling Low Power Supervisor Mode
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Community Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (September 2013) to B Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Device status is now NRND. Go

Changes from * Revision (December 2012) to A Revision

  • Changed pinout diagram, pin names FOD and PMOD pin SWAP.Go
  • Changed bq500211A Typical Low-Cost Application Diagram, VSENSE is pulled to GND.Go