SLUSBB1B December   2012  – June 2016

 

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics Curves
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Fundamentals
      2. 7.1.2 Wireless Power Consortium (WPC)
      3. 7.1.3 Power Transfer
      4. 7.1.4 Communication
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Dynamic Power Limiting™
      2. 7.3.2  Option Select Pin
      3. 7.3.3  LED Indication Modes
      4. 7.3.4  Parasitic Metal Object Detect (PMOD) and Foreign Object Detection (FOD)
      5. 7.3.5  Shut Down via External Thermal Sensor or Trigger
      6. 7.3.6  Fault Handling and Indication
      7. 7.3.7  Power Transfer Start Signal
      8. 7.3.8  Power-On Reset
      9. 7.3.9  External Reset, RESET Pin
      10. 7.3.10 Trickle Charge and CS100
      11. 7.3.11 Current Monitoring Requirements
      12. 7.3.12 Overcurrent Protection
      13. 7.3.13 MSP430G2001 Low Power Supervisor
        1. 7.3.13.1 MSP430 Low Power Supervisor Details
      14. 7.3.14 All Unused Pins
  8. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Detailed Design Procedure
        1. 8.1.1.1 Coils and Matching Capacitors
        2. 8.1.1.2 Input Regulator
        3. 8.1.1.3 Power Train
        4. 8.1.1.4 Low Power Supervisor
        5. 8.1.1.5 Disabling Low Power Supervisor Mode
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Community Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Voltage applied at V33D to GND –0.3 3.6 V
Voltage applied at V33A to GND –0.3 3.6
Voltage applied to any pin (2) –0.3 3.6
Storage temperature,TSTG –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to GND.

6.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V Supply voltage during operation, V33D, V33A 3.0 3.3 3.6 V
TA Operating free-air temperature range –40 110 °C
TJ Junction temperature 110

6.3 Thermal Information

THERMAL METRIC(1) bq500211A UNIT
RGZ (VQFN)
48 PINS
RθJA Junction-to-ambient thermal resistance 28.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 14.2 °C/W
RθJB Junction-to-board thermal resistance 5.4 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 5.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.4 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IV33A Supply current V33A = 3.3 V 8 15 mA
IV33D V33D = 3.3 V 44 55
ITOTAL V33D = V33A = 3.3 V 52 60
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS
V33 3.3-V linear regulator Emitter of NPN transistor 3.25 3.3 3.6 V
V33FB 3.3-V linear regulator feedback 4 4.6
IV33FB Series pass base drive VIN = 12 V; current into V33FB pin 10 mA
Beta Series NPN pass device 40
EXTERNALLY SUPPLIED 3.3 V POWER
V33D Digital 3.3-V power TA = 25°C 3 3.6 V
V33A Analog 3.3-V power TA = 25°C 3 3.6
V33Slew V33 slew rate V33 slew rate between 2.3 V and 2.9 V,
V33A = V33D		 0.25 V/ms
DIGITAL DEMODULATION INPUTS COMM_A+, COMM_A-, COMM_B+, COMM_B-
VCM Common mode voltage each pin –0.15 1.631 V
COMM+, COMM- Modulation voltage digital resolution 1 mV
REA Input impedance Ground reference 0.5 1.5 3 MΩ
IOFFSET Input offset current 1-kΩ source impedance –5 5 µA
ANALOG INPUTS V_SENSE, I_SENSE, T_SENSE, LED_MODE
VADDR_OPEN Voltage indicating open pin LED_MODE open 2.37 V
VADDR_SHORT Voltage indicating pin shorted to GND LED_MODE shorted to ground 0.36
VADC_RANGE Measurement range for voltage monitoring ALL ANALOG INPUTS 0 2.5
INL ADC integral nonlinearity –2.5 2.5 mV
Ilkg Input leakage current 3 V applied to pin 100 nA
RIN Input impedance Ground reference 8 MΩ
CIN Input capacitance 10 pF
DIGITAL INPUTS/OUTPUTS
VOL Low-level output voltage IOL = 6 mA , V33D = 3 V DGND1 + 0.25 V
VOH High-level output voltage IOH = -6 mA , V33D = 3 V V33D
– 0.6V
VIH High-level input voltage V33D = 3V 2.1 3.6
VIL Low-level input voltage V33D = 3.5 V 1.4
IOH(MAX) Output high source current 4 mA
IOL(MAX) Output low sink current 4
SYSTEM PERFORMANCE
VRESET Voltage where device comes out of reset V33D Pin 2.3 2.4 V
tRESET Pulse width needed for reset RESET pin 2 µs
fSW Switching Frequency 112 205 kHz
tdetect Time to detect presence of device requesting power 0.5 s
tretention Retention of configuration parameters TJ = 25°C 100 Years

6.5 Typical Characteristics Curves

bq500211A iin_v_vin_lusao2.png
Figure 1. bq500211A Supply Current vs. VCC Voltage
bq500211A fet_efficiency_lusao2.png
Figure 2. System Efficiency Using Alternate MOSFETs