SLUSBD6D July   2013  – July 2016

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Principles of Operation
        1. 7.3.1.1 Fundamentals
        2. 7.3.1.2 Wireless Power Consortium (WPC)
        3. 7.3.1.3 Power Transfer
        4. 7.3.1.4 Communication
      2. 7.3.2 Dynamic Power Limiting
      3. 7.3.3 Shut Down Through External Thermal Sensor or Trigger
      4. 7.3.4 Fault Handling and Indication
      5. 7.3.5 Power Transfer Start Signal
      6. 7.3.6 Power On Reset
      7. 7.3.7 External Reset, RESET Pin
      8. 7.3.8 Trickle Charge and CS100
    4. 7.4 Device Functional Modes
      1. 7.4.1 LED Indication Modes
      2. 7.4.2 Low Power Mode
    5. 7.5 Programming
      1. 7.5.1 Option Select Pins
      2. 7.5.2 Current Monitoring Requirements
      3. 7.5.3 All Unused Pins
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 PMOD, FOD, and FOD Calibration
        2. 8.2.2.2 Coils and Matching Capacitors
        3. 8.2.2.3 Design Checklist for WPC1.1 Compliance With the bq500212A
        4. 8.2.2.4 Input Regulator
        5. 8.2.2.5 Power Train
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage applied at V33D to GND –0.3 3.6 V
Voltage applied at V33A to GND –0.3 3.6
Voltage applied to any pin (2) –0.3 3.6
Storage temperature, Tstg –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to GND.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V Supply voltage during operation V33D, V33A 3 3.3 3.6 V
TA Operating free-air temperature –40 110 °C
TJ Junction temperature 110 °C

6.4 Thermal Information

THERMAL METRIC(1) bq500212A UNIT
RGZ (VQFN)
48 PINS
RθJA Junction-to-ambient thermal resistance 28.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 14.2 °C/W
RθJB Junction-to-board thermal resistance 5.4 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 5.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
IV33A Supply current V33A = 3.3 V 8 15 mA
IV33D V33D = 3.3 V 44 55
ITOTAL V33D = V33A = 3.3 V 52 60
INTERNAL REGULATOR CONTROLLER INPUTS AND OUTPUTS
V33 3.3-V linear regulator Emitter of NPN transistor 3.25 3.3 3.6 V
V33FB 3.3-V linear regulator feedback 4 4.6
IV33FB Series pass base drive VIN = 12 V; current into V33FB pin 10 mA
Beta Series NPN pass device 40
EXTERNALLY SUPPLIED 3.3 V POWER
V33D Digital 3.3-V power TA = 25°C 3 3.6 V
V33A Analog 3.3-V power TA = 25°C 3 3.6
V33Slew V33 slew rate V33 slew rate between 2.3 V to 2.9 V,
V33A = V33D		 0.25 V/ms
DIGITAL DEMODULATION INPUTS COMM_A+, COMM_A–, COMM_B+, COMM_B–
Vbias COMM+ bias voltage 1.5 V
COMM+, COMM– Modulation voltage digital resolution 1 mV
REA Input impedance Ground reference 0.5 1.5 3 MΩ
IOFFSET Input offset current 1-kΩ source impedance –5 5 µA
ANALOG INPUTS V_SENSE, I_SENSE, T_SENSE, LED_MODE, LOSS_THR, SNOOZE_CAP, PWR_UP
VADDR_OPEN Voltage indicating open pin LED_MODE open 2.37 V
VADDR_SHORT Voltage indicating pin shorted to GND LED_MODE shorted to ground 0.36
VADC_RANGE Measurement range for voltage monitoring All analog inputs 0 2.5
INL ADC integral nonlinearity –2.5 2.5 mV
RIN Input impedance Ground reference 8 MΩ
CIN Input capacitance 10 pF
DIGITAL INPUTS/OUTPUTS
VOL Low-level output voltage IOL = 6 mA, V33D = 3 V DGND1 + 0.25 V
VOH High-level output voltage IOH = –6 mA, V33D = 3 V V33D – 0.6 V
VIH High-level input voltage V33D = 3 V 2.1 3.6
VIL Low-level input voltage V33D = 3.5 V 1.4
IOH(MAX) Output high source current 4 mA
IOL(MAX) Output low sink current 4
SYSTEM PERFORMANCE
VRESET Voltage where device comes out of reset V33D pin 2.4 V
tRESET Pulse width needed for reset RESET pin 2 µs
ƒSW Switching Frequency 112 205 kHz

6.6 Typical Characteristics

bq500212A scope_shot_01_slusbd6d.gif
Figure 1. Typical PWM-A and PWM-B Signals
bq500212A scope_shot_03_slusbd6d.gif
Figure 3. Typical Shutdown EPT01
bq500212A scope_shot_02_slusbd6d.gif
Figure 2. Typical Start-Up With RX
bq500212A scope_shot_04_slusbd6d.gif
Figure 4. Typical Comm RX to TX