SLUSBE4B January   2014  – June 2014

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Diagram
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  A6 Coil Specification
      2. 8.3.2  EMI Shield
      3. 8.3.3  I2C Interface
      4. 8.3.4  Active or Passive Wake-up State
      5. 8.3.5  Smart Key or Immobilizer Handling
      6. 8.3.6  Option Select Pins
      7. 8.3.7  LED Modes
      8. 8.3.8  Foreign Object Detection (FOD) and Parasitic Metal Object Detect (PMOD) CalibrationForeign Object Detection (FOD) and Parasitic Metal Object Detect (PMOD) Calibration description.
      9. 8.3.9  Shut Down via External Thermal Sensor or Trigger
      10. 8.3.10 Fault Handling and Indication
      11. 8.3.11 Power Transfer Start Signal
      12. 8.3.12 Power-On Reset
      13. 8.3.13 External Reset, RESET Pin
      14. 8.3.14 Trickle Charge and CS100
        1. 8.3.14.1 Over-Current Protection Over-Current Protection description.
      15. 8.3.15 Over-Voltage Protection Over-Voltage Protection section.
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Transfer
      2. 8.4.2 Communication
      3. 8.4.3 Power Trains
      4. 8.4.4 Signal Processing Components
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Capacitor Selection
        2. 9.2.1.2 Current Monitoring Requirements
        3. 9.2.1.3 All Unused Pins
        4. 9.2.1.4 Input Regulators
        5. 9.2.1.5 Input Power Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Active or Passive Wake-up State
        2. 9.2.2.2 EMI Shield
        3. 9.2.2.3 LED mode
        4. 9.2.2.4 Number of Transmitter Coils
      3. 9.2.3 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

  1. Technology, Wireless Power Consortium, http://www.wirelesspowerconsortium.com/
  2. Analog Applications Journal, An Introduction to the Wireless Power Consortium Standard and TI’s Compliant Solutions, Johns, Bill, (Texas Instruments Literature Number SLYT401)
  3. Datasheet, Qi Compliant Wireless Power Transmitter Manager, (Texas Instruments Literature Number SLUSAL8)
  4. Datasheet, Integrated Wireless Power Supply Receiver, Qi (WPC) Compliant, bq51011, bq51013, (Texas Instruments Literature Number SLVSAT9)
  5. Application Note, Building a Wireless Power Transmitter, (Texas Instruments Literature Number SLUA635)
  6. Application Note, bqTESLA Transmitter Coil Vendors, (Texas Instruments Literature Number SLUA649)

12.2 Trademarks

All other trademarks are the property of their respective owners.

12.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.