SLUSBE4B January   2014  – June 2014

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Diagram
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  A6 Coil Specification
      2. 8.3.2  EMI Shield
      3. 8.3.3  I2C Interface
      4. 8.3.4  Active or Passive Wake-up State
      5. 8.3.5  Smart Key or Immobilizer Handling
      6. 8.3.6  Option Select Pins
      7. 8.3.7  LED Modes
      8. 8.3.8  Foreign Object Detection (FOD) and Parasitic Metal Object Detect (PMOD) CalibrationForeign Object Detection (FOD) and Parasitic Metal Object Detect (PMOD) Calibration description.
      9. 8.3.9  Shut Down via External Thermal Sensor or Trigger
      10. 8.3.10 Fault Handling and Indication
      11. 8.3.11 Power Transfer Start Signal
      12. 8.3.12 Power-On Reset
      13. 8.3.13 External Reset, RESET Pin
      14. 8.3.14 Trickle Charge and CS100
        1. 8.3.14.1 Over-Current Protection Over-Current Protection description.
      15. 8.3.15 Over-Voltage Protection Over-Voltage Protection section.
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Transfer
      2. 8.4.2 Communication
      3. 8.4.3 Power Trains
      4. 8.4.4 Signal Processing Components
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Capacitor Selection
        2. 9.2.1.2 Current Monitoring Requirements
        3. 9.2.1.3 All Unused Pins
        4. 9.2.1.4 Input Regulators
        5. 9.2.1.5 Input Power Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Active or Passive Wake-up State
        2. 9.2.2.2 EMI Shield
        3. 9.2.2.3 LED mode
        4. 9.2.2.4 Number of Transmitter Coils
      3. 9.2.3 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Voltage applied at V33D to DGND –0.3 3.6 V
Voltage applied at V33A to AGND –0.3 3.6
Voltage applied to any pin(2) –0.3 3.6
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to GND.

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –40 150 °C
V(ESD)(1) Human-Body Model (HBM)(2) 2 2 kV
Charged-Device Model (CDM)(3) 750 750 kV
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device.
(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows manufacturing without risk of damaging the device with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V Supply voltage during operation, V33D, V33A 3.0 3.3 3.6 V
TA Operating free-air temperature range –40 85 °C
TJ Junction temperature 85

7.4 Thermal Information

THERMAL METRIC(1) bq500414Q UNIT
RGZ
48 PINS
RθJA Junction-to-ambient thermal resistance 27.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 12.9
RθJB Junction-to-board thermal resistance 4.3
ψJT Junction-to-top characterization parameter 0.2
ψJB Junction-to-board characterization parameter 4.3
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
SUPPLY CURRENT
IV33A Supply current V33A = 3.3 V 8 15 mA
IV33D V33D = 3.3 V 44 55
ITotal V33D = V33A = 3.3 V 52 60
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS
V33 3.3-V linear regulator Emitter of NPN transistor 3.25 3.3 3.6 V
V33FB 3.3-V linear regulator feedback 4 4.6
IV33FB Series pass base drive VIN = 12 V; current into V33FB pin 10 mA
Beta Series NPN pass device 40
EXTERNALLY SUPPLIED 3.3 V POWER
V33D Digital 3.3-V power TA = 25°C 3 3.6 V
V33A Analog 3.3-V power TA = 25°C 3 3.6
V33Slew 3.3-V slew rate 3.3-V slew rate between 2.3 V and 2.9 V,
V33A = V33D		 0.25 V/ms
DIGITAL DEMODULATION INPUTS: COMM_A+, COMM_A-, COMM_B+, COMM_B-
VCM Common mode voltage each pin –0.15 1.631 V
COMM+, COMM- Modulation voltage digital resolution 1 mV
REA Input Impedance Ground reference 0.5 1.5 3 MΩ
IOFFSET Input offset current 1-kΩ source impedance –5 5 µA
ANALOG INPUTS: V_IN, V_SENSE, I_SENSE, T_SENSE, LED_MODE, LOSS_THR
VADC_OPEN Voltage indicating open pin LED_MODE, LOSS_THR open 2.37 V
VADC_SHORT Voltage indicating pin shorted to GND LED_MODE, LOSS_THR shorted to ground 0.36
VADC_RANGE Measurement range for voltage monitoring ALL ANALOG INPUTS 0 2.5
INL ADC integral nonlinearity –2.5 2.5 mV
Ilkg Input leakage current 3 V applied to pin 100 nA
RIN Input impedance Ground reference 8 MΩ
CIN Input capacitance 10 pF
DIGITAL INPUTS/OUTPUTS
VOL Low-level output voltage IOL = 6 mA , V33D = 3 V DGND1 + 0.25 V
VOH High-level output voltage IOH = –6 mA , V33D = 3 V V33D
– 0.6 V
VIH High-level input voltage V33D = 3 V 2.1 3.6
VIL Low-level input voltage V33D = 3.5 V 1.4
IOH(MAX) Output high source current 4 mA
IOL(MAX) Output low sink current 4
SYSTEM PERFORMANCE
VRESET Voltage where device comes out of reset V33D pin 2.4 V
tRESET Pulse width needed for reset RESET pin 2 µs
fSW Switching Frequency 120 205 kHz
tdetect Time to detect presence of device requesting power 0.5 s

7.6 Typical Characteristics

TypPWM.gifFigure 1. Typical PWM Signal
TypCOMM-Coil-NoLoad.gifFigure 3. Tx Coil and Rx Communication Signals
with Rx No Load
TypCOMM.gifFigure 2. Typical Tx Coil and Rx Communication Signals
TypCOMM-Coil-FullLoad.gifFigure 4. Tx Coil and Rx Communication Signals
with Rx 5W Load