SLUSAX0E December   2012  – April 2021 BQ7716

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Sense Positive Input for Vx
      2. 8.3.2 Output Drive, OUT
      3. 8.3.3 Supply Input, VDD
      4. 8.3.4 External Delay Capacitor, CD
    4. 8.4 Device Functional Modes
      1. 8.4.1 NORMAL Mode
      2. 8.4.2 OVERVOLTAGE Mode
      3. 8.4.3 Customer Test Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Export Control Notice
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)BQ7716xyUNIT
DPJ (WSON)
8 PINS
RθJAJunction-to-ambient thermal resistance56.6°C/W
RθJC(top)Junction-to-case(top) thermal resistance56.4°C/W
RθJBJunction-to-board thermal resistance30.6°C/W
ψJTJunction-to-top characterization parameter1.0°C/W
ψJBJunction-to-board characterization parameter37.8°C/W
RθJC(bot)Junction-to-case(bottom) thermal resistance11.3°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.