SLUSCM3K June   2016  – July 2020 BQ77904 , BQ77905

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Device Functionality Summary
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Protection Summary
      2. 8.3.2  Fault Operation
        1. 8.3.2.1  Operation in OV
        2. 8.3.2.2  Operation in UV
        3. 8.3.2.3  Operation in OW
        4. 8.3.2.4  Operation in OCD1
        5. 8.3.2.5  Operation in OCD2
        6. 8.3.2.6  Operation in SCD
        7. 8.3.2.7  Overcurrent Recovery Timer
        8. 8.3.2.8  Load Removal Detection
        9. 8.3.2.9  Load Removal Detection in UV
        10. 8.3.2.10 Operation in OTC
        11. 8.3.2.11 Operation in OTD
        12. 8.3.2.12 Operation in UTC
        13. 8.3.2.13 Operation in UTD
      3. 8.3.3  Protection Response and Recovery Summary
      4. 8.3.4  Configuration CRC Check and Comparator Built-In-Self-Test
      5. 8.3.5  Fault Detection Method
        1. 8.3.5.1 Filtered Fault Detection
      6. 8.3.6  State Comparator
      7. 8.3.7  DSG FET Driver Operation
      8. 8.3.8  CHG FET Driver Operation
      9. 8.3.9  External Override of CHG and DSG Drivers
      10. 8.3.10 Configuring 3-S, 4-S, or 5-S Mode
      11. 8.3.11 Stacking Implementations
      12. 8.3.12 Zero-Volt Battery Charging Inhibition
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Modes
        1. 8.4.1.1 Power-On Reset (POR)
        2. 8.4.1.2 FAULT Mode
        3. 8.4.1.3 SHUTDOWN Mode
        4. 8.4.1.4 Customer Fast Production Test Modes
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Recommended System Implementation
        1. 9.1.1.1 CHG and DSG FET Rise and Fall Time
        2. 9.1.1.2 Protecting CHG and LD
        3. 9.1.1.3 Protecting CHG FET
        4. 9.1.1.4 Using Load Detect for UV Fault Recovery
        5. 9.1.1.5 Temperature Protection
        6. 9.1.1.6 Adding Filter to Sense Resistor
        7. 9.1.1.7 Using a State Comparator in an Application
          1. 9.1.1.7.1 Examples
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Design Example
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

Typical values stated at TA = 25°C and VDD = 16 V (bq77904) or 20 V (bq77905). MIN and MAX values stated with TA = –40°C to +85°C and VDD = 3 to 20 V (bq77904) or VDD = 3 to 25 V (bq77905) unless otherwise noted.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
SUPPLY VOLTAGE
V(POR)POR thresholdVDD rising, 0 to 6 V4V
V(SHUT)Shutdown thresholdVDD falling, 6 to 0 V23.25V
V(AVDD)AVDD voltageC(VDD) = 1 µF2.12.53.25V
SUPPLY AND LEAKAGE CURRENT
ICCNORMAL mode current (bq77904/bq77905)Cell1 through Cell5 = 4 V,
VDD = 20 V (bq77905)
69µA
I(CFAULT)Fault condition currentState comparator on812µA
IOFFSHUTDOWN mode currentVDD < VSHUT0.5µA
ILKG(OW_DIS)Input leakage current at VCx pinsAll cell voltages = 4 V,
Open-wire disable configuration
–1000100nA
ILKG(100nA)Open-wire sink current at VCx pinsAll cell voltages = 4 V,
100-nA configuration
30110175nA
ILKG(200nA)Open-wire sink current at VCx pinsAll cell voltages = 4 V,
200-nA configuration
95210315nA
ILKG(400nA)Open-wire sink current at VCx pinsAll cell voltages = 4 V,
400-nA configuration
220425640nA
PROTECTION ACCURACIES
VOVOvervoltage programmable threshold range30004575mV
VUVUndervoltage programmable threshold range12003000mV
V(VA)OV, UV, detection accuracyTA = 25°C, OV detection accuracy–1010mV
TA = 25°C, UV detection accuracy–1818mV
TA = 0 to 60°C–2826mV
TA = –40 to 85°C–4040mV
VHYS(OV)OV hysteresis programmable threshold range0400mV
VHYS(UV)UV hysteresis programmable threshold range200800mV
VOTDOvertemperature in discharge programmable threshold (ratio of VTB)Threshold for 65°C(1)19.71%20.56%21.86%V
Threshold for 70°C (1)17.36%18.22%19.51%VTB
VOTD(REC)Overtemperature in discharge recovery (ratio of VTB)Recovery threshold at 55°C for when VOTD is at 65°C(1)25.24%26.12%27.44%VTB
Recovery threshold at 60°C for when VOTD is at 70°C(1)22.12%23.2%24.24%VTB
VOTCOvertemperature in charge programmable threshold (ratio of VTB)Threshold for 45°C(1)32.14%32.94%34.54%VTB
Threshold for 50°C(1)29.15%29.38%31.45%VTB
VOTC(REC)Overtemperature in charge recovery (ratio of VTB)Recovery threshold at 35°C when VOTD is at 45°C(1)38.63%40.97%40.99%VTB
Recovery threshold at 40°C when VOTD is at 50°C(1)36.18%36.82%38.47%VTB
VUTDUndertemperature in discharge programmable threshold (ratio of VTB)Threshold for –20°C(1)86.41%87.14%89.72%VTB
Threshold for –10°C(1)80.04%80.94%83.10%VTB
VUTD(REC)Undertemperature in discharge recovery (ratio of VTB)Recovery threshold at –10°C when VUTD is at –20°C(1)80.04%80.94%83.10%VTB
Recovery threshold at 0°C when VUTD is at –10°C(1)71.70%73.18%74.86%VTB
VUTCUndertemperature in charge programmable threshold (ratio of VTB)Threshold for –5°C(1)75.06%77.22%78.32%VTB
Threshold for 0°C(1)71.70%73.18%74.86%VTB
VUTC(REC)Undertemperature in Charge Recovery (ratio of VTB)Recovery threshold at 5°C when VUTC is at –5°C(1)68.80%69.73%71.71%VTB
Recovery threshold at 10°C when VUTC is at 0°C(1)64.67%65.52%67.46%VTB
VOCD1Overcurrent discharge 1 programmable threshold range,
(VSRP – VSRN)
–85–10mV
VOCD2Overcurrent discharge 2 programmable threshold range,
(VSRP – VSRN)
–20–170mV
VSCDShort circuit discharge programmable threshold range, (VSRP – VSRN)–40–340mV
VCCALOCD1 detection accuracy at lower thresholdsVOCD1 > –20 mV–30%30%
VCCAHOCD1, OCD2, SCD detection accuracyVOCD1 ≤ –20 mV; all OCD2 and SCD threshold ranges–20%20%
VOWOpen-wire fault voltage threshold at VCx per cell with respect to VCx-1Voltage falling on VCx, 3.6 V to
0 V
450500550mV
VOW(HYS)Hysteresis for open wire faultVoltage rising on VCx, 0 V to
3.6 V
100mV
CHARGE AND DISCHARGE FET DRIVERS
V(FETON)CHG/CHGU/DSG onVDD ≥ 12 V, CL = 10 nF111214V
VDD < 12 V, CL = 10 nFVDD – 1VDDV
V(FETOFF)CHG/CHGU/DSG offNo load when CHG/CHGU/DSG is off.0.5V
R(CHGOFF)CHG off resistanceCHG off for > tCHGPDN and pin held at 2 V0.5
R(DSGOFF)CHGU/DSG off resistanceCHGU/DSG off and pin held at 2 V1016Ω
ICHG(CLAMP)CHG clamp currentCHG off and pin held at 18 V450µA
VCHG(CLAMP)CHG clamp voltageICHG(CLAMP) = 300 µA161820.5V
tCHGONCHG on rise timeCL = 10 nF, 10% to 90%50150µs
tDSGONCHGU/DSG on rise timeCL = 10 nF, 10% to 90%275µs
tCHGOFFCHG off fall timeCL = 10 nF, 90% to 10%1530µs
tDSGOFFCHGU/DSG off fall timeCL = 10 nF, 90% to 10%515µs
CTRC AND CTRD CONTROL
VCTR1Enable FET driver (VSS)With respect to VSS. Enabled < MAX0.6V
VCTR2Enable FET driver (Stacked)Enabled > MINVDD + 2.2V
VCTR(DIS)Disable FET driverDisabled between MIN and MAX2.04VDD + 0.7V
VCTR(MAXV)CTRC and CTRD clamp voltageICTR = 600 nAVDD + 2.8VDD + 4VDD + 5V
tCTRDEG_ON)(2)CTRC and CTRD deglitch for ON signal7ms
tCTRDEG_OFF(2)CTRC and CTRD deglitch for OFF signal7ms
CURRENT STATE COMPARATOR
V(STATE_D1)Discharge qualification threshold1Measured at SRP-SRN–3–2–1mV
V(STATE_C1)Charge qualification threshold1Measured at SRP-SRN123mV
tSTATE(2)State detection qualification time1.2ms
LOAD REMOVAL DETECTION
VLD(CLAMP)LD clamp voltageI(LDCLAMP) = 300 µA161820.5V
ILD(CLAMP)LD clamp currentV(LDCLAMP) = 18 V450µA
VLDTLD thresholdLoad removed < when VLDT1.251.31.35V
RLD(INT)LD input resistance when enabledMeasured to VSS160250375
tLD_DEGLD detection deglitch11.52.3ms
CCFG PIN
V(CCFGL)CCFG threshold low (ratio of VAVDD)3-cell configuration10%V
V(CCFGH)CCFG threshold high (ratio of VAVDD)4-cell configuration65%100%V
V(CCFGHZ)CFG threshold high-Z  (ratio of VAVDD)5-cell configuration, CCFG floating, internally biased25%33%45%V
tCCFG_DEG(2)CCFG deglitch6ms
CUSTOMER TEST MODE (CTM)
V(CTM)Customer test mode entry voltage at VDDVDD > VC5 + V(CTM), TA = 25°C8.510V
tCTM_ENTRY(3)Delay time to enter and exit Customer Test ModeVDD > VC5 + V(CTM), TA = 25°C50ms
tCTM_DELAY(3)Delay time of faults while in Customer Test ModeTA = 25°C200ms
tCTM_OC_REC(3)Fault recovery time of OCD1, OCD2, and SCD faults while in Customer Test Mode1 s and 8 s options, TA = 25°C100ms
Based on a 10-KΩ pull-up and 103AT thermistor
Not production tested parameters. Specified by design
The device is in a no fault state prior to entering Customer Test Mode.