SLUSCU0L march   2018  – august 2023 BQ77915

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Device Comparison Table
  8. 7 Pin Configuration and Functions
  9. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
      1. 9.1.1 Device Functionality Summary
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Protection Summary
      2. 9.3.2  Fault Operation
        1. 9.3.2.1  Operation in OV
        2. 9.3.2.2  Operation in UV
        3. 9.3.2.3  Operation in OW
        4. 9.3.2.4  Operation in OCD1
        5. 9.3.2.5  Operation in OCD2
        6. 9.3.2.6  Programming the OCD1/2 Delay Using the OCDP Pin
        7. 9.3.2.7  Operation in SCD
        8. 9.3.2.8  Operation in OCC
        9. 9.3.2.9  Overcurrent Recovery Timer
        10. 9.3.2.10 Load Detection and Load Removal Detection
        11. 9.3.2.11 Operation in OTC
        12. 9.3.2.12 Operation in OTD
        13. 9.3.2.13 Operation in UTC
        14. 9.3.2.14 Operation in UTD
      3. 9.3.3  Protection Response and Recovery Summary
      4. 9.3.4  Cell Balancing
      5. 9.3.5  HIBERNATE Mode Operation
      6. 9.3.6  Configuration CRC Check and Comparator Built-In-Self-Test
      7. 9.3.7  Fault Detection Method
        1. 9.3.7.1 Filtered Fault Detection
      8. 9.3.8  State Comparator
      9. 9.3.9  DSG FET Driver Operation
      10. 9.3.10 CHG FET Driver Operation
      11. 9.3.11 External Override of CHG and DSG Drivers
      12. 9.3.12 Configuring 3-Series, 4-Series, or 5-Series Modes
      13. 9.3.13 Stacking Implementations
      14. 9.3.14 Zero-Volt Battery Charging Inhibition
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power Modes
        1. 9.4.1.1 Power On Reset (POR)
        2. 9.4.1.2 NORMAL Mode
        3. 9.4.1.3 FAULT Mode
        4. 9.4.1.4 HIBERNATE Mode
        5. 9.4.1.5 SHUTDOWN Mode
        6. 9.4.1.6 Customer Fast Production Test Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Recommended System Implementation
        1. 10.1.1.1 CHG and DSG FET Rise and Fall Time
        2. 10.1.1.2 Protecting CHG and LD
        3. 10.1.1.3 Protecting the CHG FET
        4. 10.1.1.4 Using Load Detect for UV Fault Recovery
        5. 10.1.1.5 Temperature Protection
        6. 10.1.1.6 Adding RC Filters to the Sense Resistor
        7. 10.1.1.7 Using the State Comparator in an Application
          1. 10.1.1.7.1 Examples
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Design Example
      3. 10.2.3 Application Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  14. 13Device and Documentation Support
    1. 13.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Pin Configuration and Functions

GUID-54724EFF-3B2D-46C4-8BFE-F5F8FFB04664-low.svg Figure 7-1 PW Package24-Pin TSSOPTop View
Table 7-1 Pin Functions
NUMBER NAME I/O DESCRIPTION
1 VDD P(1) Supply voltage
2 AVDD O Analog supply (only connect to a capacitor)
3 VC5 I Cell voltage sense inputs
4 VC4 I
5 VC3 I
6 VC2 I
7 VC1 I
8 VC0 I
9 VSS P Analog ground
10 SRP I Current sense input connecting to the battery side of the sense resistor
11 SRN I Current sense input connecting to the pack side of the sense resistor
12 DSG O DSG FET driver output
13 CHG O CHG FET driver output
14 LD I PACK– load removal detection
15 LPWR O HIBERNATE mode communication pin. Connect to the PRES pin of the lower device in a stack configuration. For a single device, leave the LPWR pin floating.
16 CBI I Cell balancing input. Leave the CBI pin floating to disable cell balancing, and do not drive with an external supply. Drive the pin low to enable cell balancing. In a stacked configuration, connect the CBI pin of an upper device to the CBO pin of the immediate lower device.
17 OCDP I Connecting a resistor from this pin to VSS programs the OCD1/2 fault detection delay. Connect to a 10-MΩ resistor to VSS for the upper devices in a stack.
18 TS I Thermistor measurement input. Connect a 10-kΩ resistor to the VSS pin if the function is not used.
19 VTB O Thermistor bias output
20 CCFG I Cell in-series configuration input
21 CBO O Cell balancing output. Connect through a 10-k resistor to the CBI pin of the upper device in a stacked configuration. For a single device, leave the CBO pin floating.
22 PRES I HIBERNATE mode input. Drive high for NORMAL mode operation. Leave the PRES pin floating for HIBERNATE mode. Connect to the LPWR pin of the upper device in a stack configuration.
23 CTRC I CHG and DSG override inputs
24 CTRD I
(1) I = Input, O = Output, P = Power