SLUSC23 September   2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Supply Current
    5. 7.5  Power Supply Control
    6. 7.6  Low-Voltage General Purpose I/O, TS1
    7. 7.7  Power-On Reset (POR)
    8. 7.8  Internal 1.8-V LDO
    9. 7.9  Current Wake Comparator
    10. 7.10 Coulomb Counter
    11. 7.11 ADC Digital Filter
    12. 7.12 ADC Multiplexer
    13. 7.13 Cell Balancing Support
    14. 7.14 Internal Temperature Sensor
    15. 7.15 NTC Thermistor Measurement Support
    16. 7.16 High-Frequency Oscillator
    17. 7.17 Low-Frequency Oscillator
    18. 7.18 Voltage Reference 1
    19. 7.19 Voltage Reference 2
    20. 7.20 Instruction Flash
    21. 7.21 Data Flash
    22. 7.22 Current Protection Thresholds
    23. 7.23 Current Protection Timing
    24. 7.24 N-CH FET Drive (CHG, DSG)
    25. 7.25 I2C and HDQ Interface I/O
    26. 7.26 I2C Interface Timing
    27. 7.27 HDQ Interface Timing
    28. 7.28 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Battery Parameter Measurements
        1. 8.3.1.1 bq78z100 Processor
      2. 8.3.2  Coulomb Counter (CC)
      3. 8.3.3  CC Digital Filter
      4. 8.3.4  ADC Multiplexer
      5. 8.3.5  Analog-to-Digital Converter (ADC)
      6. 8.3.6  ADC Digital Filter
      7. 8.3.7  Internal Temperature Sensor
      8. 8.3.8  External Temperature Sensor Support
      9. 8.3.9  Power Supply Control
      10. 8.3.10 Power-On Reset
      11. 8.3.11 Bus Communication Interface
      12. 8.3.12 Cell Balancing Support
      13. 8.3.13 N-Channel Protection FET Drive
      14. 8.3.14 Low Frequency Oscillator
      15. 8.3.15 High Frequency Oscillator
      16. 8.3.16 1.8-V Low Dropout Regulator
      17. 8.3.17 Internal Voltage References
      18. 8.3.18 Overcurrent in Discharge Protection
      19. 8.3.19 Short-Circuit Current in Charge Protection
      20. 8.3.20 Short-Circuit Current in Discharge 1 and 2 Protection
      21. 8.3.21 Primary Protection Features
      22. 8.3.22 Gas Gauging
      23. 8.3.23 Charge Control Features
      24. 8.3.24 Authentication
    4. 8.4 Device Functional Modes
      1. 8.4.1 Lifetime Logging Features
      2. 8.4.2 Configuration
        1. 8.4.2.1 Coulomb Counting
        2. 8.4.2.2 Cell Voltage Measurements
        3. 8.4.2.3 Current Measurements
        4. 8.4.2.4 Auto Calibration
        5. 8.4.2.5 Temperature Measurements
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements (Default)
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Setting Design Parameters
      3. 9.2.3 Calibration Process
      4. 9.2.4 Gauging Data Updates
        1. 9.2.4.1 Application Curve
  10. 10Power Supply Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Documentation Support

See the bq78z100 Technical Reference Manual (SLUUB63) for more information.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.