SLUSF21 Data sheet

SLUSF21 june 2023 BQ79616

PRODUCTION DATA

Package Options

Mechanical Data (Package|Pins)

PAP|64
- MPQF071C

Thermal pad, mechanical data (Package|Pins)

PAP|64
- PPTD012N

Orderable Information

8.3.2.1 Main ADC

There are total of 24 inputs (slots) multiplexed to the Main ADC (Figure 8-2). All inputs are measured in round robin fashion (Figure 8-3). Each input takes 8 μs (nominal) to measure and a single round robin cycle completes in 192 μs (nominal). The inputs to the Main ADC are:

Die temperature 1
TSREF
Cell1 to Cell16 voltages through differential VC_n–1 to VC_n, where n = 1 to 16
Bus bar input through differential BBP–BBN pins
Multiplexed GPIO1 through GPIO8
Spares (RSVD)

All measurements are reported in 16-bit hexadecimal in 2s complement. Results are reported to the corresponding *_HI (high-byte) and *_LO (low-byte) registers. First, convert the hexadecimal results to decimal values. Follow the equations in Table 8-1 to translate the result to μV or °C.

When the Main ADC is enabled, all Main ADC-related result registers shown in Table 8-1 are reset to the default value 0x8000. The measured result is populated to the result registers as the main ADC makes its conversion along the round robin cycle. When MCU reads the *_HI register, the device will pause the data refresh to the associated *_LO register until that *_LO register is read.

Table 8-1 Main ADC Measurement Conversion Equations

Main ADC Inputs	Result Registers	Conversion Equations
Die Temperature 1	DIETEMP1_HI/LO	Result in °C = V_{LSB_MAIN_DIETEMP1} * Result in decimal 0x0000h is centered to 0°C.
TSREF	TSREF_HI/LO	Result in μV = V_{LSB_TSREF} * Result in decimal
Cell1 to Cell16	VCELL_HI/LO, where = 1 to 16	Result in μV = V_{LSB_ADC} * Result in decimal
Bus Bar	BUSBAR_HI/LO	Result in μV = V_{LSB_BB} * Result in decimal
GPIO1 to GPIO8	GPIO_HI/LO, where = 1 to 8	Result in μV = V_{LSB_GPIO} * Result in decimal

Figure 8-2 Main ADC Measurement Path

Figure 8-3 Main ADC Round Robin Measurements