SBOS030C August   2000  – March 2024 BUF634

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: TO-220 and TO-263 Packages
    6. 6.6 Electrical Characteristics: Wide-Bandwidth Mode for SOIC Package
    7. 6.7 Electrical Characteristics: Low-Quiescent-Current Mode for SOIC Package
    8. 6.8 Typical Characteristics: TO-220 and TO-263 Packages
    9. 6.9 Typical Characteristics: SOIC Package
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Current
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 High Frequency Applications
    2. 8.2 Typical Application
      1. 8.2.1 Boosting Op Amp Output Current
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Dissipation
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 TINA-TI™ Simulation Software (Free Download)
        2. 9.1.1.2 TI Reference Designs
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • KTT|5
  • KC|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1.1 High Frequency Applications

The excellent bandwidth and fast slew rate of the BUF634 device are useful in a variety of high frequency open-loop applications. When operated open-loop, printed-circuit-board layout and bypassing technique can affect dynamic performance.

For best results, use a ground plane-type circuit board layout and bypass the power supplies with 0.1-µF ceramic chip capacitors at the device pins in parallel with solid tantalum 10-µF capacitors. Source resistance affects high-frequency peaking, step-response overshoot and ringing. Best response is usually achieved with a series input resistor of 25 Ω to 200 Ω, depending on the signal source. Response with some loads (especially capacitive) can be improved with a resistor of 10 Ω to 150 Ω in series with the output.

GUID-CBCDD9B7-0A72-4ECB-8D24-6594FC45C76E-low.gifFigure 8-2 High Performance Headphone Driver
GUID-29CE5D68-BB39-48AC-B6D7-375AD2E0F646-low.gifFigure 8-3 Pseudo-Ground Driver
GUID-E1591D45-1CD9-49C3-8357-6F8FE02AEB06-low.gifFigure 8-4 Current-Output Valve Driver
GUID-00649BD0-2456-4554-A20C-F925B7D4610C-low.gifFigure 8-5 Bridge-Connected Motor Driver