SBOS030C August   2000  – March 2024 BUF634

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: TO-220 and TO-263 Packages
    6. 6.6 Electrical Characteristics: Wide-Bandwidth Mode for SOIC Package
    7. 6.7 Electrical Characteristics: Low-Quiescent-Current Mode for SOIC Package
    8. 6.8 Typical Characteristics: TO-220 and TO-263 Packages
    9. 6.9 Typical Characteristics: SOIC Package
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Current
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 High Frequency Applications
    2. 8.2 Typical Application
      1. 8.2.1 Boosting Op Amp Output Current
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Dissipation
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 TINA-TI™ Simulation Software (Free Download)
        2. 9.1.1.2 TI Reference Designs
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • KTT|5
  • KC|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The BUF634 is a high-speed, unity-gain, open-loop buffer recommended for a wide range of applications. The BUF634 can be used inside the feedback loop of op amps to increase output current, eliminate thermal feedback, and improve capacitive load drive.

For low-power applications, the BUF634 operates on 1.5mA quiescent current with 250mA output, 2000V/µs slew rate, and 30MHz bandwidth. Bandwidth can be adjusted from 30MHz to 180MHz by connecting a resistor between V– and the BW pin.

Output circuitry is fully protected by internal current limit and thermal shutdown, making the device rugged and easy to use.

The BUF634 is available in a variety of packages to meet mechanical and power-dissipation requirements. Types include SOIC‑8 surface-mount, 5‑lead TO‑220, and a 5‑lead TO‑263 (DDPAK) surface-mount plastic power packages.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
BUF634 D (SOIC, 8) 4.9mm × 6mm
KC (TO-220, 5) 10.16mm × 4.45mm
KTT (TO-263, 5) 10.16mm × 15.24mm
(1) For more information, see Section 11.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.

 

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