SBOS948F February   2019  – May 2021 BUF634A

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Wide-Bandwidth Mode
    6. 7.6 Electrical Characteristics: Low-Quiescent Current Mode
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Current
      2. 8.3.2 Thermal Shutdown
      3. 8.3.3 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Adjustable Bandwidth
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 High-Frequency Applications
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Dissipation and Thermal Considerations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 SOIC Layout Guidelines (D Package Without a Thermal Pad)
      2. 11.1.2 HSOIC Layout Guidelines (DDA Package With a Thermal Pad)
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 TINA-TI (Free Software Download)
        2. 12.1.2.2 TI Precision Designs
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DDA|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The BUF634A device is a high-performance, high-fidelity, open-loop buffer that is capable of driving 250 mA of output current. The BUF634A is a 36-V device with an adjustable bandwidth of 35 MHz to 210 MHz, which is accomplished by varying the value of an external resistor between the V– and BW pins.

The BUF634A device can be used as a standalone open-loop driver, or used inside the feedback loop of a precision op amp to provide both high-precision and large output current drive with improved capacitive load drive.

For low-power applications, the BUF634A device operates on a 1.5-mA quiescent current with a 250-mA output, 3750-V/µs slew rate, and 35-MHz bandwidth. The device consumes 8.5-mA quiescent current in wide-bandwidth mode with a 210-MHz bandwidth. The BUF634A is fully protected by an internal current limit in its output stage and by thermal shutdown, making the device rugged and easy to use.

The BUF634A device is rated to function over the extended industrial temperature range of –40°C to +125°C. The BUF634A comes in three packages: D (SOIC), DRB (VSON), and DDA (HSOIC). The DRB (VSON) and DDA (HSOIC) packages have excellent thermal performance resulting from the thermal pad on the bottom side. The DRB package comes in a very small form factor of 3.0 mm × 3.0 mm, making the device a very suitable option for portable and size-constrained applications.

Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
BUF634A SOIC (8) 4.90 mm × 3.90 mm
VSON (8) 3.00 mm × 3.00 mm
HSOIC (8) 4.90 mm × 3.90 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
GUID-A142ED22-EC0C-41A4-8BA9-5506B40F1AB4-low.gifBoost the Output Current of Any Operational Amplifier
GUID-20210518-CA0I-FGTW-GQMF-RH7RLNKHZGFR-low.gifThermal Performance vs Cu Area for the DDA Package