SWRS046I November   2006  – September 2018 CC1020

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Configuration
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  RF Transmit
    5. 4.5  RF Receive
    6. 4.6  RSSI / Carrier Sense
    7. 4.7  Intermediate Frequency (IF)
    8. 4.8  Crystal Oscillator
    9. 4.9  Frequency Synthesizer
    10. 4.10 Digital Inputs and Outputs
    11. 4.11 Current Consumption
    12. 4.12 Thermal Resistance Characteristics for VQFNP Package
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Configuration Overview
      1. 5.3.1 Configuration Software
    4. 5.4  Microcontroller Interface
      1. 5.4.1 Configuration Interface
      2. 5.4.2 Signal Interface
      3. 5.4.3 PLL Lock Signal
    5. 5.5  4-wire Serial Configuration Interface
    6. 5.6  Signal Interface
      1. 5.6.1 Synchronous NRZ Mode
      2. 5.6.2 Transparent Asynchronous UART Mode
      3. 5.6.3 Synchronous Manchester Encoded Mode
        1. 5.6.3.1 Manchester Encoding and Decoding
    7. 5.7  Data Rate Programming
    8. 5.8  Frequency Programming
      1. 5.8.1 Dithering
    9. 5.9  Receiver
      1. 5.9.1  IF Frequency
      2. 5.9.2  Receiver Channel Filter Bandwidth
      3. 5.9.3  Demodulator, Bit Synchronizer, and Data Decision
      4. 5.9.4  Receiver Sensitivity Versus Data Rate and Frequency Separation
      5. 5.9.5  RSSI
      6. 5.9.6  Image Rejection Calibration
      7. 5.9.7  Blocking and Selectivity
      8. 5.9.8  Linear IF Chain and AGC Settings
      9. 5.9.9  AGC Settling
      10. 5.9.10 Preamble Length and Sync Word
      11. 5.9.11 Carrier Sense
      12. 5.9.12 Automatic Power-up Sequencing
      13. 5.9.13 Automatic Frequency Control
      14. 5.9.14 Digital FM
    10. 5.10 Transmitter
      1. 5.10.1 FSK Modulation Formats
      2. 5.10.2 Output Power Programming
      3. 5.10.3 TX Data Latency
      4. 5.10.4 Reducing Spurious Emission and Modulation Bandwidth
    11. 5.11 Input and Output Matching and Filtering
    12. 5.12 Frequency Synthesizer
      1. 5.12.1 VCO, Charge Pump and PLL Loop Filter
      2. 5.12.2 VCO and PLL Self-Calibration
      3. 5.12.3 PLL Turn-on Time Versus Loop Filter Bandwidth
      4. 5.12.4 PLL Lock Time Versus Loop Filter Bandwidth
    13. 5.13 VCO and LNA Current Control
    14. 5.14 Power Management
    15. 5.15 On-Off Keying (OOK)
    16. 5.16 Crystal Oscillator
    17. 5.17 Built-in Test Pattern Generator
    18. 5.18 Interrupt on Pin DCLK
      1. 5.18.1 Interrupt Upon PLL Lock
      2. 5.18.2 Interrupt Upon Received Signal Carrier Sense
    19. 5.19 PA_EN and LNA_EN Digital Output Pins
      1. 5.19.1 Interfacing an External LNA or PA
      2. 5.19.2 General Purpose Output Control Pins
      3. 5.19.3 PA_EN and LNA_EN Pin Drive
    20. 5.20 System Considerations and Guidelines
      1. 5.20.1 SRD Regulations
      2. 5.20.2 Narrowband Systems
      3. 5.20.3 Low Cost Systems
      4. 5.20.4 Battery Operated Systems
      5. 5.20.5 High Reliability Systems
      6. 5.20.6 Frequency Hopping Spread Spectrum Systems (FHSS)
    21. 5.21 Antenna Considerations
    22. 5.22 Configuration Registers
      1. 5.22.1 Memory
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Information
      1. 6.1.1 Typical Application
    2. 6.2 Design Requirements
      1. 6.2.1 Input and Output Matching
      2. 6.2.2 Bias Resistor
      3. 6.2.3 PLL Loop Filter
      4. 6.2.4 Crystal
      5. 6.2.5 Additional Filtering
      6. 6.2.6 Power Supply Decoupling and Filtering
    3. 6.3 PCB Layout Recommendations
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Device Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Community Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Export Control Notice
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3.2 Pin Configuration

Table 3-1 provides an overview of the CC1020 device pinout.

Table 3-1 Pin Attributes(1)(2)

PIN NO. PIN NAME TYPE DESCRIPTION
— AGND Ground (analog) Exposed die attached pad. Must be soldered to a solid ground plane as this is the ground connection for all analog modules. See Section 6.3 for more details.
1 PCLK Digital input Programming clock for SPI configuration interface
2 PDI Digital input Programming data input for SPI configuration interface
3 PDO Digital output Programming data output for SPI configuration interface
4 DGND Ground (digital) Ground connection (0 V) for digital modules and digital I/O
5 DVDD Power (digital) Power supply (3 V typical) for digital modules and digital I/O
6 DGND Ground (digital) Ground connection (0 V) for digital modules (substrate)
7 DCLK Digital output Clock for data in both receive and transmit mode.
Can be used as receive data output in asynchronous mode
8 DIO Digital input/output Data input in transmit mode; data output in receive mode.
Can also be used to start power-up sequencing in receive
9 LOCK Digital output PLL Lock indicator, active low. Output is asserted (low) when PLL is in lock. The pin can also be used as a general digital output, or as receive data output in synchronous NRZ/Manchester mode
10 XOSC_Q1 Analog input Crystal oscillator or external clock input
11 XOSC_Q2 Analog output Crystal oscillator
12 AVDD Power (analog) Power supply (3 V typical) for crystal oscillator
13 AVDD Power (analog) Power supply (3 V typical) for the IF VGA
14 LNA_EN Digital output General digital output. Can be used for controlling an external LNA if higher sensitivity is needed.
15 PA_EN Digital output General digital output. Can be used for controlling an external PA if higher output power is needed.
16 AVDD Power (analog) Power supply (3 V typical) for global bias generator and IF anti-alias filter
17 R_BIAS Analog output Connection for external precision bias resistor (82 kΩ, ±1%)
18 AVDD Power (analog) Power supply (3 V typical) for LNA input stage
19 RF_IN RF Input RF signal input from antenna (external AC-coupling)
20 AVDD Power (analog) Power supply (3 V typical) for LNA
21 RF_OUT RF output RF signal output to antenna
22 AVDD Power (analog) Power supply (3 V typical) for LO buffers, mixers, prescaler, and first PA stage
23 AVDD Power (analog) Power supply (3 V typical) for VCO
24 VC Analog input VCO control voltage input from external loop filter
25 AGND Ground (analog) Ground connection (0 V) for analog modules (guard)
26 AD_REF Power (analog) 3 V reference input for ADC
27 AVDD Power (analog) Power supply (3 V typical) for charge pump and phase detector
28 CHP_OUT Analog output PLL charge pump output to external loop filter
29 AVDD Power (analog) Power supply (3 V typical) for ADC
30 DGND Ground (digital) Ground connection (0 V) for digital modules (guard)
31 DVDD Power (digital) Power supply connection (3 V typical) for digital modules
32 PSEL Digital input Programming chip select, active low, for configuration interface. Internal pullup resistor.
(1) DCLK, DIO and LOCK are high-impedance (3-state) in power down (BIAS_PD = 1 in the MAIN register).
(2) The exposed die attached pad must be soldered to a solid ground plane as this is the main ground connection for the chip.