SWRS046I November   2006  – September 2018 CC1020

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Configuration
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  RF Transmit
    5. 4.5  RF Receive
    6. 4.6  RSSI / Carrier Sense
    7. 4.7  Intermediate Frequency (IF)
    8. 4.8  Crystal Oscillator
    9. 4.9  Frequency Synthesizer
    10. 4.10 Digital Inputs and Outputs
    11. 4.11 Current Consumption
    12. 4.12 Thermal Resistance Characteristics for VQFNP Package
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Configuration Overview
      1. 5.3.1 Configuration Software
    4. 5.4  Microcontroller Interface
      1. 5.4.1 Configuration Interface
      2. 5.4.2 Signal Interface
      3. 5.4.3 PLL Lock Signal
    5. 5.5  4-wire Serial Configuration Interface
    6. 5.6  Signal Interface
      1. 5.6.1 Synchronous NRZ Mode
      2. 5.6.2 Transparent Asynchronous UART Mode
      3. 5.6.3 Synchronous Manchester Encoded Mode
        1. 5.6.3.1 Manchester Encoding and Decoding
    7. 5.7  Data Rate Programming
    8. 5.8  Frequency Programming
      1. 5.8.1 Dithering
    9. 5.9  Receiver
      1. 5.9.1  IF Frequency
      2. 5.9.2  Receiver Channel Filter Bandwidth
      3. 5.9.3  Demodulator, Bit Synchronizer, and Data Decision
      4. 5.9.4  Receiver Sensitivity Versus Data Rate and Frequency Separation
      5. 5.9.5  RSSI
      6. 5.9.6  Image Rejection Calibration
      7. 5.9.7  Blocking and Selectivity
      8. 5.9.8  Linear IF Chain and AGC Settings
      9. 5.9.9  AGC Settling
      10. 5.9.10 Preamble Length and Sync Word
      11. 5.9.11 Carrier Sense
      12. 5.9.12 Automatic Power-up Sequencing
      13. 5.9.13 Automatic Frequency Control
      14. 5.9.14 Digital FM
    10. 5.10 Transmitter
      1. 5.10.1 FSK Modulation Formats
      2. 5.10.2 Output Power Programming
      3. 5.10.3 TX Data Latency
      4. 5.10.4 Reducing Spurious Emission and Modulation Bandwidth
    11. 5.11 Input and Output Matching and Filtering
    12. 5.12 Frequency Synthesizer
      1. 5.12.1 VCO, Charge Pump and PLL Loop Filter
      2. 5.12.2 VCO and PLL Self-Calibration
      3. 5.12.3 PLL Turn-on Time Versus Loop Filter Bandwidth
      4. 5.12.4 PLL Lock Time Versus Loop Filter Bandwidth
    13. 5.13 VCO and LNA Current Control
    14. 5.14 Power Management
    15. 5.15 On-Off Keying (OOK)
    16. 5.16 Crystal Oscillator
    17. 5.17 Built-in Test Pattern Generator
    18. 5.18 Interrupt on Pin DCLK
      1. 5.18.1 Interrupt Upon PLL Lock
      2. 5.18.2 Interrupt Upon Received Signal Carrier Sense
    19. 5.19 PA_EN and LNA_EN Digital Output Pins
      1. 5.19.1 Interfacing an External LNA or PA
      2. 5.19.2 General Purpose Output Control Pins
      3. 5.19.3 PA_EN and LNA_EN Pin Drive
    20. 5.20 System Considerations and Guidelines
      1. 5.20.1 SRD Regulations
      2. 5.20.2 Narrowband Systems
      3. 5.20.3 Low Cost Systems
      4. 5.20.4 Battery Operated Systems
      5. 5.20.5 High Reliability Systems
      6. 5.20.6 Frequency Hopping Spread Spectrum Systems (FHSS)
    21. 5.21 Antenna Considerations
    22. 5.22 Configuration Registers
      1. 5.22.1 Memory
  6. 6Applications, Implementation, and Layout
    1. 6.1 Application Information
      1. 6.1.1 Typical Application
    2. 6.2 Design Requirements
      1. 6.2.1 Input and Output Matching
      2. 6.2.2 Bias Resistor
      3. 6.2.3 PLL Loop Filter
      4. 6.2.4 Crystal
      5. 6.2.5 Additional Filtering
      6. 6.2.6 Power Supply Decoupling and Filtering
    3. 6.3 PCB Layout Recommendations
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Device Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Community Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Export Control Notice
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6.3 Synchronous Manchester Encoded Mode

In transmit mode, the CC1020 device provides the data clock at DCLK and DIO is used as data input. Data is clocked into the CC1020 device at the rising edge of DCLK and should be in NRZ format. The data is modulated at RF with Manchester code. The encoding is done by the CC1020 device. In this mode, the effective bit rate is half the baud rate due to the coding. As an example, 4.8 kBaud Manchester encoded data corresponds to 2.4 kbps.

In receive mode, the CC1020 device performs the synchronization and provides received data clock at DCLK and data at DIO. The CC1020 device performs the decoding and NRZ data is presented at DIO. The data should be clocked into the interfacing circuit at the rising edge of DCLK. See Figure 5-7.

In synchronous NRZ or Manchester mode, the DCLK signal runs continuously both in RX and TX unless the DCLK signal is gated with the carrier sense signal or the PLL lock signal. Refer to Section 5.18 and Section 5.18.2 for more details.

If SEP_DI_DO = 0 in the INTERFACE register, the DIO pin is the data output in receive mode and data input in transmit mode.

As an option, the data output can be made available at a separate pin. This is done by setting SEP_DI_DO = 1 in the INTERFACE register. Then, the LOCK pin will be used as data output in synchronous mode, overriding other use of the LOCK pin.