SWRS109C May   2011  – December 2016 CC110L

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Signal Descriptions
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  General Characteristics
    5. 4.5  Current Consumption
      1. 4.5.1 Typical TX Current Consumption over Temperature and Supply Voltage, 868 MHz
      2. 4.5.2 Typical TX Current Consumption over Temperature and Supply Voltage, 915 MHz
    6. 4.6  Typical RX Current Consumption Over Temperature and Input Power Level, 868 or 915 MHz
    7. 4.7  RF Receive Section
      1. 4.7.1 Typical Sensitivity over Temperature and Supply Voltage, 868 MHz, Sensitivity Optimized Setting
      2. 4.7.2 Typical Sensitivity over Temperature and Supply Voltage, 915 MHz, Sensitivity Optimized Setting
      3. 4.7.3 Blocking and Selectivity
    8. 4.8  RF Transmit Section
      1. 4.8.1 Typical Variation in Output Power over Temperature and Supply Voltage, 868 MHz
      2. 4.8.2 Typical Variation in Output Power over Temperature and Supply Voltage, 915 MHz
    9. 4.9  Crystal Oscillator
    10. 4.10 Frequency Synthesizer Characteristics
    11. 4.11 DC Characteristics
    12. 4.12 Power-On Reset
    13. 4.13 Thermal Characteristics
    14. 4.14 Typical Characteristics
      1. 4.14.1 Typical Characteristics, RX Current Consumption
      2. 4.14.2 Typical Characteristics, Blocking and Selectivity
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Configuration Overview
    4. 5.4  Configuration Software
    5. 5.5  4-wire Serial Configuration and Data Interface
    6. 5.6  Chip Status Byte
    7. 5.7  Register Access
    8. 5.8  SPI Read
    9. 5.9  Command Strobes
    10. 5.10 FIFO Access
    11. 5.11 PATABLE Access
    12. 5.12 Microcontroller Interface and Pin Configuration
      1. 5.12.1 Configuration Interface
      2. 5.12.2 General Control and Status Pins
    13. 5.13 Data Rate Programming
    14. 5.14 Receiver Channel Filter Bandwidth
    15. 5.15 Demodulator, Symbol Synchronizer, and Data Decision
      1. 5.15.1 Frequency Offset Compensation
      2. 5.15.2 Bit Synchronization
      3. 5.15.3 Byte Synchronization
    16. 5.16 Packet Handling Hardware Support
      1. 5.16.1 Packet Format
        1. 5.16.1.1 Arbitrary Length Field Configuration
        2. 5.16.1.2 Packet Length > 255
      2. 5.16.2 Packet Filtering in Receive Mode
        1. 5.16.2.1 Address Filtering
        2. 5.16.2.2 Maximum Length Filtering
        3. 5.16.2.3 CRC Filtering
      3. 5.16.3 Packet Handling in Transmit Mode
      4. 5.16.4 Packet Handling in Receive Mode
      5. 5.16.5 Packet Handling in Firmware
    17. 5.17 Modulation Formats
      1. 5.17.1 Frequency Shift Keying
      2. 5.17.2 Amplitude Modulation
    18. 5.18 Received Signal Qualifiers and RSSI
      1. 5.18.1 Sync Word Qualifier
      2. 5.18.2 RSSI
      3. 5.18.3 Carrier Sense (CS)
        1. 5.18.3.1 CS Absolute Threshold
        2. 5.18.3.2 CS Relative Threshold
      4. 5.18.4 Clear Channel Assessment (CCA)
    19. 5.19 Radio Control
      1. 5.19.1 Power-On Start-Up Sequence
        1. 5.19.1.1 Automatic POR
        2. 5.19.1.2 Manual Reset
      2. 5.19.2 Crystal Control
      3. 5.19.3 Voltage Regulator Control
      4. 5.19.4 Active Modes (RX and TX)
      5. 5.19.5 RX Termination
      6. 5.19.6 Timing
        1. 5.19.6.1 Overall State Transition Times
        2. 5.19.6.2 Frequency Synthesizer Calibration Time
    20. 5.20 Data FIFO
    21. 5.21 Frequency Programming
    22. 5.22 VCO
      1. 5.22.1 VCO and PLL Self-Calibration
    23. 5.23 Voltage Regulators
    24. 5.24 Output Power Programming
    25. 5.25 General Purpose and Test Output Control Pins
    26. 5.26 Asynchronous and Synchronous Serial Operation
      1. 5.26.1 Asynchronous Serial Operation
      2. 5.26.2 Synchronous Serial Operation
    27. 5.27 System Considerations and Guidelines
      1. 5.27.1 SRD Regulations
      2. 5.27.2 Frequency Hopping and Multi-Channel Systems
      3. 5.27.3 Wideband Modulation when not Using Spread Spectrum
      4. 5.27.4 Data Burst Transmissions
      5. 5.27.5 Continuous Transmissions
      6. 5.27.6 Increasing Range
    28. 5.28 Configuration Registers
      1. 5.28.1 Configuration Register Details - Registers with preserved values in SLEEP state
      2. 5.28.2 Configuration Register Details - Registers that Loose Programming in SLEEP State
      3. 5.28.3 Status Register Details
    29. 5.29 Development Kit Ordering Information
  6. 6Applications, Implementation, and Layout
    1. 6.1 Bias Resistor
    2. 6.2 Balun and RF Matching
    3. 6.3 Crystal
    4. 6.4 Reference Signal
    5. 6.5 Additional Filtering
    6. 6.6 Power Supply Decoupling
    7. 6.7 PCB Layout Recommendations
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Device Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation from Texas Instruments
      2. 7.2.2 Community Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Export Control Notice
    6. 7.6 Glossary
    7. 7.7 Additional Acronyms
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Device Overview

1.1 Features

  • RF Performance
    • Programmable Output Power up to +12 dBm
    • Receive Sensitivity Down to −116 dBm at
      0.6 kbps
    • Programmable Data Rate from 0.6 to 600 kbps
    • Frequency Bands: 300–348 MHz,
      387–464 MHz, and 779–928 MHz
    • 2-FSK, 4-FSK, GFSK, MSK, and OOK Supported
  • Digital Features
    • Flexible Support for Packet Oriented Systems
    • On-chip Support for Sync Word Insertion, Flexible Packet Length, and Automatic CRC Calculation
  • Low-Power Features
    • 200-nA Sleep Mode Current Consumption
    • Fast Startup Time; 240 μs From Sleep to RX Mode or TX Mode
    • 64-Byte RX and TX FIFO
  • Improved Range Using CC1190
    • The CC1190 is a Range Extender for
      850–950 MHz and is an Ideal Fit for CC110L to Enhance RF Performance
    • High Sensitivity
      • –118 dBm at 1.2 kBaud, 868 MHz, 1% Packet Error Rate
      • –120 dBm at 1.2 kBaud, 915 MHz, 1% Packet Error Rate
    • +20-dBm Output Power at 868 MHz
    • +26-dBm Output Power at 915 MHz
  • General
    • Few External Components; Completely On-chip Frequency Synthesizer, No External Filters or RF Switch Needed
    • Green Package: RoHS Compliant and No Antimony or Bromine
    • Small Size (QLP 4- x 4-mm Package, 20 Pins)
    • Suited for Systems Targeting Compliance with EN 300 220 (Europe) and FCC CFR Part 15 (US)
    • Support for Asynchronous and Synchronous Serial Transmit Mode for Backward Compatibility with Existing Radio Communication Protocols

1.2 Applications

  • Ultra Low-Power Wireless Applications Operating in the 315-, 433-, 868-, 915-MHz ISM or SRD Bands
  • Wireless Alarm and Security Systems
  • Industrial Monitoring and Control
  • Remote Controls
  • Toys
  • Home and Building Automation

1.3 Description

The CC110L is a cost optimized sub-1 GHz RF transceiver for the 300–348 MHz, 387–464 MHz, and 779–928 MHz frequency bands. The circuit is based on the popular CC1101 RF transceiver, and RF performance characteristics are identical. Two CC110L transceivers together enable a low-cost bidirectional RF link.

The RF transceiver is integrated with a highly configurable baseband modem. The modem supports various modulation formats and has a configurable data rate up to 600 kbps.

The CC110L provides extensive hardware support for packet handling, data buffering, and burst transmissions.

The main operating parameters and the 64-byte receive and transmit FIFOs of CC110L can be controlled through a serial peripheral interface (SPI). In a typical system, the CC110L will be used together with a microcontroller and a few additional passive components.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE
CC110LRGP QFN (20) 4.00 mm × 4.00 mm
(1) For more information on these devices, see Section 8, Mechanical Packaging and Orderable Information.

1.4 Functional Block Diagram

Figure 1-1 shows a functional block diagram of the device.

CC110L CC110L_simp_bd_swrs109.gif Figure 1-1 Functional Block Diagram