SWRS109C May   2011  – December 2016 CC110L

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Signal Descriptions
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  General Characteristics
    5. 4.5  Current Consumption
      1. 4.5.1 Typical TX Current Consumption over Temperature and Supply Voltage, 868 MHz
      2. 4.5.2 Typical TX Current Consumption over Temperature and Supply Voltage, 915 MHz
    6. 4.6  Typical RX Current Consumption Over Temperature and Input Power Level, 868 or 915 MHz
    7. 4.7  RF Receive Section
      1. 4.7.1 Typical Sensitivity over Temperature and Supply Voltage, 868 MHz, Sensitivity Optimized Setting
      2. 4.7.2 Typical Sensitivity over Temperature and Supply Voltage, 915 MHz, Sensitivity Optimized Setting
      3. 4.7.3 Blocking and Selectivity
    8. 4.8  RF Transmit Section
      1. 4.8.1 Typical Variation in Output Power over Temperature and Supply Voltage, 868 MHz
      2. 4.8.2 Typical Variation in Output Power over Temperature and Supply Voltage, 915 MHz
    9. 4.9  Crystal Oscillator
    10. 4.10 Frequency Synthesizer Characteristics
    11. 4.11 DC Characteristics
    12. 4.12 Power-On Reset
    13. 4.13 Thermal Characteristics
    14. 4.14 Typical Characteristics
      1. 4.14.1 Typical Characteristics, RX Current Consumption
      2. 4.14.2 Typical Characteristics, Blocking and Selectivity
  5. 5Detailed Description
    1. 5.1  Overview
    2. 5.2  Functional Block Diagram
    3. 5.3  Configuration Overview
    4. 5.4  Configuration Software
    5. 5.5  4-wire Serial Configuration and Data Interface
    6. 5.6  Chip Status Byte
    7. 5.7  Register Access
    8. 5.8  SPI Read
    9. 5.9  Command Strobes
    10. 5.10 FIFO Access
    11. 5.11 PATABLE Access
    12. 5.12 Microcontroller Interface and Pin Configuration
      1. 5.12.1 Configuration Interface
      2. 5.12.2 General Control and Status Pins
    13. 5.13 Data Rate Programming
    14. 5.14 Receiver Channel Filter Bandwidth
    15. 5.15 Demodulator, Symbol Synchronizer, and Data Decision
      1. 5.15.1 Frequency Offset Compensation
      2. 5.15.2 Bit Synchronization
      3. 5.15.3 Byte Synchronization
    16. 5.16 Packet Handling Hardware Support
      1. 5.16.1 Packet Format
        1. 5.16.1.1 Arbitrary Length Field Configuration
        2. 5.16.1.2 Packet Length > 255
      2. 5.16.2 Packet Filtering in Receive Mode
        1. 5.16.2.1 Address Filtering
        2. 5.16.2.2 Maximum Length Filtering
        3. 5.16.2.3 CRC Filtering
      3. 5.16.3 Packet Handling in Transmit Mode
      4. 5.16.4 Packet Handling in Receive Mode
      5. 5.16.5 Packet Handling in Firmware
    17. 5.17 Modulation Formats
      1. 5.17.1 Frequency Shift Keying
      2. 5.17.2 Amplitude Modulation
    18. 5.18 Received Signal Qualifiers and RSSI
      1. 5.18.1 Sync Word Qualifier
      2. 5.18.2 RSSI
      3. 5.18.3 Carrier Sense (CS)
        1. 5.18.3.1 CS Absolute Threshold
        2. 5.18.3.2 CS Relative Threshold
      4. 5.18.4 Clear Channel Assessment (CCA)
    19. 5.19 Radio Control
      1. 5.19.1 Power-On Start-Up Sequence
        1. 5.19.1.1 Automatic POR
        2. 5.19.1.2 Manual Reset
      2. 5.19.2 Crystal Control
      3. 5.19.3 Voltage Regulator Control
      4. 5.19.4 Active Modes (RX and TX)
      5. 5.19.5 RX Termination
      6. 5.19.6 Timing
        1. 5.19.6.1 Overall State Transition Times
        2. 5.19.6.2 Frequency Synthesizer Calibration Time
    20. 5.20 Data FIFO
    21. 5.21 Frequency Programming
    22. 5.22 VCO
      1. 5.22.1 VCO and PLL Self-Calibration
    23. 5.23 Voltage Regulators
    24. 5.24 Output Power Programming
    25. 5.25 General Purpose and Test Output Control Pins
    26. 5.26 Asynchronous and Synchronous Serial Operation
      1. 5.26.1 Asynchronous Serial Operation
      2. 5.26.2 Synchronous Serial Operation
    27. 5.27 System Considerations and Guidelines
      1. 5.27.1 SRD Regulations
      2. 5.27.2 Frequency Hopping and Multi-Channel Systems
      3. 5.27.3 Wideband Modulation when not Using Spread Spectrum
      4. 5.27.4 Data Burst Transmissions
      5. 5.27.5 Continuous Transmissions
      6. 5.27.6 Increasing Range
    28. 5.28 Configuration Registers
      1. 5.28.1 Configuration Register Details - Registers with preserved values in SLEEP state
      2. 5.28.2 Configuration Register Details - Registers that Loose Programming in SLEEP State
      3. 5.28.3 Status Register Details
    29. 5.29 Development Kit Ordering Information
  6. 6Applications, Implementation, and Layout
    1. 6.1 Bias Resistor
    2. 6.2 Balun and RF Matching
    3. 6.3 Crystal
    4. 6.4 Reference Signal
    5. 6.5 Additional Filtering
    6. 6.6 Power Supply Decoupling
    7. 6.7 PCB Layout Recommendations
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Device Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation from Texas Instruments
      2. 7.2.2 Community Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Export Control Notice
    6. 7.6 Glossary
    7. 7.7 Additional Acronyms
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Device and Documentation Support

7.1 Device Support

7.1.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, CC110L). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RGP) and the temperature range (for example, blank is the default commercial temperature range).

For orderable part numbers of CC110L devices in the QFN package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

7.2 Documentation Support

7.2.1 Related Documentation from Texas Instruments

The following documents describe the CC110L transceiver. Copies of these documents are available on the Internet at www.ti.com.

    SWRR046Characterization Design 315 - 433 MHz (Identical to the CC1101EM 315 - 433 MHz Reference Design)
    SWRR045Characterization Design 868 - 915 MHz (Identical to the CC1101EM 868 - 915 MHz Reference Design)
    SWRA147DN010 Close-in Reception with CC1101
    SWRA168DN017 CC11xx 868/915 MHz RF Matching
    SWRA159DN015 Permanent Frequency Offset Compensation
    SWRA123DN006 CC11xx Settings for FCC 15.247 Solutions
    SWRA114DN505 RSSI Interpretation and Timing
    SWRA168DN013 Programming Output Power on CC1101
    SWRA215DN022 CC11xx OOK/ASK register settings
    SWRA122DN005 CC11xx Sensitivity versus Frequency Offset and Crystal Accuracy
    SWRA356AN094 Using the CC1190 Front End with CC1101 under EN 300 220
    SWRA361AN096 Using the CC1190 Front End with CC1101 under FCC 15.247
    SWRA346DN032 Options for Cost Optimized CC11xx Matching
    SWRR081CC110LEM / CC115LEM 433 MHz Reference Design
    SWRR082CC110LEM / CC115LEM 868 - 915 MHz Reference Design

7.2.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community The TI engineer-to-engineer (E2E) community was created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

7.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

7.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.5 Export Control Notice

Recipient agrees to not knowingly export or re-export, directly or indirectly, any product or technical data (as defined by the U.S., EU, and other Export Administration Regulations) including software, or any controlled product restricted by other applicable national regulations, received from Disclosing party under this Agreement, or any direct product of such technology, to any destination to which such export or re-export is restricted or prohibited by U.S. or other applicable laws, without obtaining prior authorization from U.S. Department of Commerce and other competent Government authorities to the extent required by those laws.

7.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms and definitions.

7.7 Additional Acronyms

Additional acronyms used in this data sheet are described below.

    2-FSK Binary Frequency Shift Keying
    ADC Analog to Digital Converter
    AFC Automatic Frequency Compensation
    AGC Automatic Gain Control
    AMR Automatic Meter Reading
    BER Bit Error Rate
    BT Bandwidth-Time product
    CCA Clear Channel Assessment
    CFR Code of Federal Regulations
    CRC Cyclic Redundancy Check
    CS Carrier Sense
    CW Continuous Wave (Unmodulated Carrier)
    DC Direct Current
    DVGA Digital Variable Gain Amplifier
    ESR Equivalent Series Resistance
    FCC Federal Communications Commission
    FHSS Frequency Hopping Spread Spectrum
    FS Frequency Synthesizer
    GFSK Gaussian shaped Frequency Shift Keying
    IF Intermediate Frequency
    I/Q In-Phase/Quadrature
    ISM Industrial, Scientific, Medical
    LC Inductor-Capacitor
    LNA Low Noise Amplifier
    LO Local Oscillator
    LSB Least Significant Bit
    MCU Microcontroller Unit
    MSB Most Significant Bit
    NRZ Non Return to Zero (Coding)
    OOK On-Off Keying
    PA Power Amplifier
    PCB Printed Circuit Board
    PD Power Down
    PER Packet Error Rate
    PLL Phase Locked Loop
    POR Power-On Reset
    PQI Preamble Quality Indicator
    PTAT Proportional To Absolute Temperature
    QLP Quad Leadless Package
    QPSK Quadrature Phase Shift Keying
    RC Resistor-Capacitor
    RF Radio Frequency
    RSSI Received Signal Strength Indicator
    RX Receive, Receive Mode
    SMD Surface Mount Device
    SNR Signal to Noise Ratio
    SPI Serial Peripheral Interface
    SRD Short Range Devices
    T/R Transmit/Receive
    TX Transmit, Transmit Mode
    VCO Voltage Controlled Oscillator
    XOSC Crystal Oscillator
    XTAL Crystal