SWRS112H June   2011  – July 2015 CC1120

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Configuration
  4. 4Specifications
    1. 4.1  ESD Ratings
    2. 4.2  Recommended Operating Conditions (General Characteristics)
    3. 4.3  RF Characteristics
    4. 4.4  Power Consumption Summary
    5. 4.5  Receive Parameters
    6. 4.6  Transmit Parameters
    7. 4.7  PLL Parameters
    8. 4.8  32-MHz Clock Input (TCXO)
    9. 4.9  32-MHz Crystal Oscillator
    10. 4.10 32-kHz Clock Input
    11. 4.11 32-kHz RC Oscillator
    12. 4.12 I/O and Reset
    13. 4.13 Temperature Sensor
    14. 4.14 Thermal Resistance Characteristics for RHB Package
    15. 4.15 Timing Requirements
    16. 4.16 Regulatory Standards
    17. 4.17 Typical Characteristics
  5. 5Detailed Description
    1. 5.1 Block Diagram
    2. 5.2 Frequency Synthesizer
    3. 5.3 Receiver
    4. 5.4 Transmitter
    5. 5.5 Radio Control and User Interface
    6. 5.6 Enhanced Wake-On-Radio (eWOR)
    7. 5.7 Sniff Mode
    8. 5.8 Antenna Diversity
    9. 5.9 WaveMatch
  6. 6Application, Implementation, and Layout
    1. 6.1 Application Information
      1. 6.1.1 Typical Application Circuit
      2. 6.1.2 TI Reference Designs
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Configuration Software
      2. 7.1.2 Device and Development-Support Tool Nomenclature
    2. 7.2 Documentation Support
      1. 7.2.1 Community Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  8. 8Mechanical Packaging and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Application, Implementation, and Layout

NOTE

Information in the following Applications section is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

6.1 Application Information

6.1.1 Typical Application Circuit

NOTE

This section is intended only as an introduction. The reference designs listed in Section 6.1.2 show everything required.

Very few external components are required for the operation of the CC1120 device. Figure 6-1 shows a typical application circuit. The board layout will greatly influence the RF performance of the CC1120 device. Figure 6-1 does not show decoupling capacitors for power pins.

CC1120 typapp_swrs112.gifFigure 6-1 Typical Application Circuit

6.1.2 TI Reference Designs

The following reference designs are available for the CC1120 device:

    CC1120EM-868-915-RDCC1120EM 868- to 915-MHz Reference Design
    This RF Layout Reference Design demonstrates good decoupling and layout techniques for a low power RF device operating in the 868-MHz and 915-MHz frequency bands.

    CC1120EM 868/915 MHz Reference Design (SWRC222)

    CC112x IPC 868- and 915-MHz 2-layer Reference Design (SWRR106)

    CC112x IPC 868- and 915-MHz 4-layer Reference Design (SWRR107)

    CC1120EM-169-RDCC1120EM 169-MHz Reference Design
    This RF Layout Reference Design demonstrates good decoupling and layout techniques for a low power RF device operating in the 169-MHz frequency band. (SWRC220)
    CC1120EM-420-470-RDCC1120EM 420- to 470-MHz Reference Design
    This RF Layout Reference Design demonstrates good decoupling and layout techniques for a low power RF device operating in the 420-470 MHz frequency band. (SWRC221)