SWRS120E June   2011  – October 2014 CC1125

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
    1. 3.1 Pin Diagram
    2. 3.2 Pin Configuration
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Recommended Operating Conditions (General Characteristics)
    4. 4.4  Thermal Resistance Characteristics for RHB Package
    5. 4.5  RF Characteristics
    6. 4.6  Regulatory Standards
    7. 4.7  Current Consumption, Static Modes
    8. 4.8  Current Consumption, Transmit Modes
      1. 4.8.1 950-MHz Band (High-Performance Mode)
      2. 4.8.2 868-, 915-, and 920-MHz Bands (High-Performance Mode)
      3. 4.8.3 434-MHz Band (High-Performance Mode)
      4. 4.8.4 169-MHz Band (High Performance Mode)
      5. 4.8.5 Low-Power Mode
    9. 4.9  Current Consumption, Receive Modes
      1. 4.9.1 High-Performance Mode
      2. 4.9.2 Low-Power Mode
    10. 4.10 Receive Parameters
      1. 4.10.1 General Receive Parameters (High-Performance Mode)
      2. 4.10.2 RX Performance in 950-MHz Band (High-Performance Mode)
      3. 4.10.3 RX Performance in 868-, 915-, and 920-MHz Bands (High-Performance Mode)
      4. 4.10.4 RX Performance in 434-MHz Band (High-Performance Mode)
      5. 4.10.5 RX Performance in 169-MHz Band (High-Performance Mode)
      6. 4.10.6 RX Performance in Low-Power Mode
    11. 4.11 Transmit Parameters
    12. 4.12 PLL Parameters
      1. 4.12.1 High-Performance Mode
      2. 4.12.2 Low-Power Mode
    13. 4.13 Wake-up and Timing
    14. 4.14 High-Speed Crystal Oscillator
    15. 4.15 High-Speed Clock Input (TCXO)data to TCXO table
    16. 4.16 32-kHz Clock Input
    17. 4.17 Low Speed RC Oscillator
    18. 4.18 I/O and Reset
    19. 4.19 Temperature Sensor
    20. 4.20 Typical Characteristics
  5. 5Detailed Description
    1. 5.1 Block Diagram
    2. 5.2 Frequency Synthesizer
    3. 5.3 Receiver
    4. 5.4 Transmitter
    5. 5.5 Radio Control and User Interface
    6. 5.6 4.5 Enhanced Wake-On-Radio (eWOR)
    7. 5.7 Sniff Mode
    8. 5.8 Antenna Diversity
    9. 5.9 WaveMatch
  6. 6Typical Application Circuit
  7. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Configuration Software
      2. 7.1.2 Device and Development-Support Tool Nomenclature
    2. 7.2 Documentation Support
    3. 7.3 Community Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  8. 8Mechanical Packaging and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Device and Documentation Support

7.1 Device Support

7.1.1 Development Support

7.1.1.1 Configuration Software

The CC1125 device can be configured using the SmartRF Studio software (SWRC046). The SmartRF Studio software is highly recommended for obtaining optimum register settings, and for evaluating performance and functionality.

7.1.2 Device and Development-Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all microprocessors (MPUs) and support tools. Each device has one of three prefixes: X, P, or null (no prefix) (for example, CC1125). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMDX) through fully qualified production devices and tools (TMDS).

Device development evolutionary flow:

    XExperimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    PPrototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    nullProduction version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RHB), the temperature range (for example, blank is the default commercial temperature range), and the device speed range, in megahertz. provides a legend for reading the complete device name for any CC1125 device.

For orderable part numbers of CC1125 devices in the QFN package types, see the Package Option Addendum of this document, the TI website (www.ti.com), or contact your TI sales representative.

7.2 Documentation Support

The following documents supplement the CC1125 processor. Copies of these documents are available on the Internet at www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com.

    SWRR106CC112x IPC 868- and 915-MHz 2-layer Reference Design
    SWRR107CC112x IPC 868- and 915-MHz 4-layer Reference Design
    SWRR100CC1125EM 169-MHz Reference Design
    SWRR101CC1125EM 420- to 470-MHz Reference Design
    SWRR102CC1121EM 868- to 915-MHz Reference Design
    SWRR097CC1120EM CAT1 868-MHz Reference Design
    SWRA428CC112x/CC120x Sniff Mode Application Note

7.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help developers get started with Embedded Processors from Texas Instruments and to foster innovation and growth of general knowledge about the hardware and software surrounding these devices.

7.4 Trademarks

SmartRF, E2E are trademarks of Texas Instruments.

7.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

7.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.