SWRS181D September   2015  – July 2018 CC1310

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram – RSM Package
    2. 4.2 Signal Descriptions – RSM Package
    3. 4.3 Pin Diagram – RHB Package
    4. 4.4 Signal Descriptions – RHB Package
    5. 4.5 Pin Diagram – RGZ Package
    6. 4.6 Signal Descriptions – RGZ Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  RF Characteristics
    6. 5.6  Receive (RX) Parameters, 861 MHz to 1054 MHz
    7. 5.7  Receive (RX) Parameters, 431 MHz to 527 MHz
    8. 5.8  Transmit (TX) Parameters, 861 MHz to 1054 MHz
    9. 5.9  Transmit (TX) Parameters, 431 MHz to 527 MHz
    10. 5.10 PLL Parameters
    11. 5.11 ADC Characteristics
    12. 5.12 Temperature Sensor
    13. 5.13 Battery Monitor
    14. 5.14 Continuous Time Comparator
    15. 5.15 Low-Power Clocked Comparator
    16. 5.16 Programmable Current Source
    17. 5.17 DC Characteristics
    18. 5.18 Thermal Characteristics
    19. 5.19 Timing and Switching Characteristics
      1. 5.19.1 Reset Timing
        1. Table 5-1 Reset Timing
      2. 5.19.2 Wakeup Timing
        1. Table 5-2 Wakeup Timing
      3. 5.19.3 Clock Specifications
        1. Table 5-3 24-MHz Crystal Oscillator (XOSC_HF)
        2. Table 5-4 32.768-kHz Crystal Oscillator (XOSC_LF)
        3. Table 5-5 48-MHz RC Oscillator (RCOSC_HF)
        4. Table 5-6 32-kHz RC Oscillator (RCOSC_LF)
      4. 5.19.4 Flash Memory Characteristics
        1. Table 5-7 Flash Memory Characteristics
      5. 5.19.5 Synchronous Serial Interface (SSI) Characteristics
        1. Table 5-8 Synchronous Serial Interface (SSI) Characteristics
    20. 5.20 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Main CPU
    3. 6.3  RF Core
    4. 6.4  Sensor Controller
    5. 6.5  Memory
    6. 6.6  Debug
    7. 6.7  Power Management
    8. 6.8  Clock Systems
    9. 6.9  General Peripherals and Modules
    10. 6.10 Voltage Supply Domains
    11. 6.11 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 TI Design or Reference Design
  8. 8Device and Documentation Support
    1. 8.1  Device Nomenclature
    2. 8.2  Tools and Software
    3. 8.3  Documentation Support
    4. 8.4  Texas Instruments Low-Power RF Website
    5. 8.5  Additional Information
    6. 8.6  Community Resources
    7. 8.7  Trademarks
    8. 8.8  Electrostatic Discharge Caution
    9. 8.9  Export Control Notice
    10. 8.10 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Power Consumption Summary

Measured on the Texas Instruments CC1310EM-7XD-7793 reference design unless otherwise noted. Tc = 25°C, VDDS = 3.6 V with DC/DC enabled, unless otherwise noted. Using boost mode (increasing VDDR to 1.95 V), will increase currents in this table by 15% (does not apply to TX 14-dBm setting where this current is already included).
PARAMETER TEST CONDITIONS TYP UNIT
Icore Core current
consumption		 Reset. RESET_N pin asserted or VDDS below power-on-reset threshold 100 nA
Shutdown. No clocks running, no retention 185
Standby. With RTC, CPU, RAM, and (partial) register retention. RCOSC_LF 0.7 µA
Standby. With RTC, CPU, RAM, and (partial) register retention. XOSC_LF 0.8
Idle. Supply Systems and RAM powered. 570
Active. MCU running CoreMark at 48 MHz 1.2 mA + 25.5 µA/MHz
Active. MCU running CoreMark at 48 MHz 2.5 mA
Active. MCU running CoreMark at 24 MHz 1.9
Radio RX, 868 MHz 5.5 mA
Radio TX, 10-dBm output power, (G)FSK, 868 MHz 13.4 mA
Radio TX, OOK modulation, 10-dBm output power, AVG 11.2 mA
Radio TX, boost mode (VDDR = 1.95 V), 14-dBm output power, (G)FSK, 868 MHz 23.5 mA
Radio TX, OOK modulation, boost mode (VDDR = 1.95 V), 14-dBm, AVG 14.8 mA
Radio TX, boost mode (VDDR = 1.95 V), 15-dBm output power, (G)FSK, measured on CC1310EM-7XD-4251, 433.92 MHz 25.1 mA
Radio TX, 10-dBm output power, measured on CC1310EM-7XD-4251, 433.92 MHz 13.2 mA
PERIPHERAL CURRENT CONSUMPTION(1)(2)(3)
Iperi Peripheral power domain Delta current with domain enabled 20 µA
Serial power domain Delta current with domain enabled 13
RF core Delta current with power domain enabled,
clock enabled, RF core idle		 237
µDMA Delta current with clock enabled, module idle 130
Timers Delta current with clock enabled, module idle 113
I2C Delta current with clock enabled, module idle 12
I2S Delta current with clock enabled, module idle 36
SSI Delta current with clock enabled, module idle 93
UART Delta current with clock enabled, module idle 164
(1) Adds to core current Icore for each peripheral unit activated
(2) Iperi is not supported in standby or shutdown modes.
(3) Measured at 3.0 V