SWRS255 March   2022 CC1311P3

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
  7. 7 Pin Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 861 MHz to 1054 MHz - Receive (RX)
    11. 8.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 8.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 8.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 8.14 359 MHz to 527 MHz - Receive (RX)
    15. 8.15 359 MHz to 527 MHz - Transmit (TX) 
    16. 8.16 359 MHz to 527 MHz - PLL Phase Noise
    17. 8.17 Timing and Switching Characteristics
      1. 8.17.1 Reset Timing
      2. 8.17.2 Wakeup Timing
      3. 8.17.3 Clock Specifications
        1. 8.17.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.17.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.17.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
        4. 8.17.3.4 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.17.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.17.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       38
      5. 8.17.5 UART
        1. 8.17.5.1 UART Characteristics
    18. 8.18 Peripheral Characteristics
      1. 8.18.1 ADC
        1. 8.18.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.18.2 DAC
        1. 8.18.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.18.3 Temperature and Battery Monitor
        1. 8.18.3.1 Temperature Sensor
        2. 8.18.3.2 Battery Monitor
      4. 8.18.4 Comparator
        1. 8.18.4.1 Continuous Time Comparator
      5. 8.18.5 GPIO
        1. 8.18.5.1 GPIO DC Characteristics
    19. 8.19 Typical Characteristics
      1. 8.19.1 MCU Current
      2. 8.19.2 RX Current
      3. 8.19.3 TX Current
      4. 8.19.4 RX Performance
      5. 8.19.5 TX Performance
      6. 8.19.6 ADC Performance
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Proprietary Radio Formats
    4. 9.4  Memory
    5. 9.5  Cryptography
    6. 9.6  Timers
    7. 9.7  Serial Peripherals and I/O
    8. 9.8  Battery and Temperature Monitor
    9. 9.9  µDMA
    10. 9.10 Debug
    11. 9.11 Power Management
    12. 9.12 Clock Systems
    13. 9.13 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
  11. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.15 359 MHz to 527 MHz - Transmit (TX) 

Measured on the LAUNCHXL-CC1352P-4 reference design with Tc = 25 °C, VDDS = 3.0 V with DC/DC enabled unless otherwise noted.
All measurements are performed at the antenna input with a combined RX and TX path, except for high power PA which is measured at a dedicated antenna connection. All measurements are performed conducted. (1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
General parameters
Max output power,
Regular PA		 433.92 MHz, without BOOST (VDDR = 1.7 V) 13 dBm
Output power programmable range
Regular PA		 433.92 MHz, without BOOST (VDDR = 1.7 V) 24 dB

Output power variation over temperature, regular PA		 +13 dBm setting. 433.92 MHz
Over recommended temperature operating range		 ±1.5 dB
Spurious emissions and harmonics
Spurious emissions (excluding harmonics)
Regular PA(3)		 30 MHz to 1 GHz +10 dBm setting
ETSI restricted bands		 < -54 dBm
+10 dBm setting
ETSI outside restricted bands		 < -36 dBm
1 GHz to 12.75 GHz
(outside ETSI restricted bands)		 +10 dBm setting
measured in 1 MHz bandwidth (ETSI)		 < -30 dBm
Spurious emissions out-of-band
Regular PA, 429 MHz(3)		 Outside the necessary requency band
(ARIB T-67)		 +10 dBm setting < -26 dBm
710 MHz to 900 MHz
(ARIB T-67)		 +10 dBm setting < -55 dBm
900 MHz to 915 MHz
(ARIB T-67)		 +10 dBm setting < -55 dBm
930 MHz to 1000 MHz
(ARIB T-67)		 +10 dBm setting < -55 dBm
1000 MHz to 1215 MHz
(ARIB T-67)		 +10 dBm setting < -45 dBm
Above 1215 MHz
(ARIB T-67)		 +10 dBm setting < -30 dBm
Harmonics
Regular PA		 Second harmonic +13 dBm setting, 433 MHz < -36 dBm
Harmonics
Regular PA		 Third harmonic +13 dBm setting, 433 MHz < -30 dBm
Harmonics
Regular PA		 Fourth harmonic +13 dBm setting, 433 MHz < -30 dBm
Harmonics
Regular PA		 Fifth harmonic +13 dBm setting, 433 MHz < -30 dBm
(1) Some combinations of frequency, data rate and modulation format requires use of external crystal load capacitors for regulatory compliance. More details can be found in the device errata.
(2) Suitable for systems targeting compliance with EN 300 220, EN 303 131, EN 303 204, FCC CFR47 Part 15, ARIB STD-T108.