SWRS256 March   2022 CC1311R3

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
  7. 7 Pin Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Pin Diagram – RKP Package (Top View)
    4. 7.4 Signal Descriptions – RKP Package
    5. 7.5 Connections for Unused Pins and Modules
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 861 MHz to 1054 MHz - Receive (RX)
    11. 8.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 8.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 8.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 8.14 359 MHz to 527 MHz - Receive (RX)
    15. 8.15 359 MHz to 527 MHz - Transmit (TX) 
    16. 8.16 359 MHz to 527 MHz - PLL Phase Noise
    17. 8.17 Timing and Switching Characteristics
      1. 8.17.1 Reset Timing
      2. 8.17.2 Wakeup Timing
      3. 8.17.3 Clock Specifications
        1. 8.17.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 8.17.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 8.17.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
        4. 8.17.3.4 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.17.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.17.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       40
      5. 8.17.5 UART
        1. 8.17.5.1 UART Characteristics
    18. 8.18 Peripheral Characteristics
      1. 8.18.1 ADC
        1. 8.18.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.18.2 DAC
        1. 8.18.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.18.3 Temperature and Battery Monitor
        1. 8.18.3.1 Temperature Sensor
        2. 8.18.3.2 Battery Monitor
      4. 8.18.4 Comparator
        1. 8.18.4.1 Continuous Time Comparator
      5. 8.18.5 GPIO
        1. 8.18.5.1 GPIO DC Characteristics
    19. 8.19 Typical Characteristics
      1. 8.19.1 MCU Current
      2. 8.19.2 RX Current
      3. 8.19.3 TX Current
      4. 8.19.4 RX Performance
      5. 8.19.5 TX Performance
      6. 8.19.6 ADC Performance
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Proprietary Radio Formats
    4. 9.4  Memory
    5. 9.5  Cryptography
    6. 9.6  Timers
    7. 9.7  Serial Peripherals and I/O
    8. 9.8  Battery and Temperature Monitor
    9. 9.9  µDMA
    10. 9.10 Debug
    11. 9.11 Power Management
    12. 9.12 Clock Systems
    13. 9.13 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  11. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
  • RKP|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2 Signal Descriptions – RGZ Package

Table 7-1 Signal Descriptions – RGZ Package
PINI/OTYPEDESCRIPTION
NAMENO.
DCDC_SW33—PowerOutput from internal DC/DC converter(1)
DCOUPL23—PowerFor decoupling of internal 1.27 V regulated digital-supply (3)
DIO_16I/ODigitalGPIO
DIO_27I/ODigitalGPIO
DIO_38I/ODigitalGPIO
DIO_49I/ODigitalGPIO
DIO_510I/ODigitalGPIO, high-drive capability
DIO_611I/ODigitalGPIO, high-drive capability
DIO_712I/ODigitalGPIO, high-drive capability
DIO_814I/ODigitalGPIO
DIO_915I/ODigitalGPIO
DIO_1016I/ODigitalGPIO
DIO_1117I/ODigitalGPIO
DIO_1218I/ODigitalGPIO
DIO_1319I/ODigitalGPIO
DIO_1420I/ODigitalGPIO
DIO_1521I/ODigitalGPIO
DIO_1626I/ODigitalGPIO, JTAG_TDO, high-drive capability
DIO_1727I/ODigitalGPIO, JTAG_TDI, high-drive capability
DIO_1828I/ODigitalGPIO
DIO_1929I/ODigitalGPIO
DIO_2030I/ODigitalGPIO
DIO_2131I/ODigitalGPIO
DIO_2232I/ODigitalGPIO
DIO_2336I/ODigital or AnalogGPIO, analog capability
DIO_2437I/ODigital or AnalogGPIO, analog capability
DIO_2538I/ODigital or AnalogGPIO, analog capability
DIO_2639I/ODigital or AnalogGPIO, analog capability
DIO_2740I/ODigital or AnalogGPIO, analog capability
DIO_2841I/ODigital or AnalogGPIO, analog capability
DIO_2942I/ODigital or AnalogGPIO, analog capability
DIO_3043I/ODigital or AnalogGPIO, analog capability
EGP——GNDGround – exposed ground pad(5)
JTAG_TMSC24I/ODigitalJTAG TMSC, high-drive capability
JTAG_TCKC25IDigitalJTAG TCKC
RESET_N35IDigitalReset, active low. No internal pullup resistor
RF_P1—RFPositive RF input signal to LNA during RX
Positive RF output signal from PA during TX
RF_N2—RFNegative RF input signal to LNA during RX
Negative RF output signal from PA during TX
RX_TX3—RFOptional bias pin for the RF LNA
VDDR45—PowerInternal supply, must be powered from the internal DC/DC converter or the internal LDO(3)(7)(11)
VDDR_RF48—PowerInternal supply, must be powered from the internal DC/DC converter or the internal LDO(3)(9)(11)
VDDS44—Power1.8-V to 3.8-V main chip supply(1)
VDDS213—Power1.8-V to 3.8-V DIO supply(1)
VDDS322—Power1.8-V to 3.8-V DIO supply(1)
VDDS_DCDC34—Power1.8-V to 3.8-V DC/DC converter supply
X48M_N46—Analog48-MHz crystal oscillator pin 1
X48M_P47—Analog48-MHz crystal oscillator pin 2
X32K_Q14—Analog32-kHz crystal oscillator pin 1
X32K_Q25—Analog32-kHz crystal oscillator pin 2
(1) For more details, see the device technical reference manual listed in Section 11.3.
(3) Do not supply external circuitry from this pin.
(5) EGP is the only ground connection for the device. Good electrical connection to device ground on printed circuit board (PCB) is imperative for proper device operation.
(7) If internal DC/DC converter is not used, this pin is supplied internally from the main LDO.
(9) If internal DC/DC converter is not used, this pin must be connected to VDDR for supply from the main LDO.
(11) Output from internal DC/DC and LDO is trimmed to 1.68 V.