SWRS256 March 2022 CC1311R3
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | PACKAGE | UNIT | ||||||
---|---|---|---|---|---|---|---|---|
RGZ (VQFN) |
RKP (VQFN) |
|||||||
48 PINS | 40 PINS | |||||||
RθJA | Junction-to-ambient thermal resistance | 25.0 | 30.9 | °C/W(2) | ||||
RθJC(top) | Junction-to-case (top) thermal resistance | 14.5 | 20.2 | °C/W(2) | ||||
RθJB | Junction-to-board thermal resistance | 8.7 | 10.3 | °C/W(2) | ||||
ψJT | Junction-to-top characterization parameter | 0.2 | 0.2 | °C/W(2) | ||||
ψJB | Junction-to-board characterization parameter | 8.6 | 10.3 | °C/W(2) | ||||
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.1 | 2.1 | °C/W(2) |