SWRS293
November 2023
CC1312PSIP
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Functional Block Diagram
5
Revision History
6
Device Comparison
7
Pin Configuration and Functions
7.1
Pin Diagram – MOT Package (Top View)
7.2
Signal Descriptions – MOT Package
7.3
Connections for Unused Pins and Modules
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Power Supply and Modules
8.5
Power Consumption - Power Modes
8.6
Power Consumption - Radio Modes
8.7
Nonvolatile (Flash) Memory Characteristics
8.8
Thermal Resistance Characteristics
8.9
RF Frequency Bands
8.10
861 MHz to 1054 MHz - Receive (RX)
8.11
861 MHz to 1054 MHz - Transmit (TX)
8.12
861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
8.13
861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
8.14
Timing and Switching Characteristics
8.14.1
Reset Timing
8.14.2
Wakeup Timing
8.14.3
Clock Specifications
8.14.3.1
48 MHz Crystal Oscillator (XOSC_HF) and RF frequency accuracy
8.14.3.2
48 MHz RC Oscillator (RCOSC_HF)
8.14.3.3
2 MHz RC Oscillator (RCOSC_MF)
8.14.3.4
32.768 kHz Crystal Oscillator (XOSC_LF) and RTC accuracy
8.14.3.5
32 kHz RC Oscillator (RCOSC_LF)
8.14.4
Synchronous Serial Interface (SSI) Characteristics
36
8.14.4.1.1
Synchronous Serial Interface (SSI) Characteristics
8.14.5
UART
8.14.5.1
UART Characteristics
8.15
Peripheral Characteristics
8.15.1
ADC
8.15.1.1
Analog-to-Digital Converter (ADC) Characteristics
8.15.2
DAC
8.15.2.1
Digital-to-Analog Converter (DAC) Characteristics
8.15.3
Temperature and Battery Monitor
8.15.3.1
Temperature Sensor
8.15.3.2
Battery Monitor
8.15.4
Comparators
8.15.4.1
Low-Power Clocked Comparator
8.15.4.2
Continuous Time Comparator
8.15.5
Current Source
8.15.5.1
Programmable Current Source
8.15.6
GPIO
8.15.6.1
GPIO DC Characteristics
8.16
Typical Characteristics
8.16.1
MCU Current
8.16.2
RX Current
8.16.3
TX Current
8.16.4
RX Performance
8.16.5
TX Performance
8.16.6
ADC Performance
8.16.7
Temperature Compensation
9
Detailed Description
9.1
Overview
9.2
System CPU
9.3
Radio (RF Core)
9.3.1
Proprietary Radio Formats
9.4
Memory
9.5
Sensor Controller
9.6
Cryptography
9.7
Timers
9.8
Serial Peripherals and I/O
9.9
Battery and Temperature Monitor
9.10
µDMA
9.11
Debug
9.12
Power Management
9.13
Clock Systems, production calibration and temperature compensation
9.14
Network Processor
9.15
Device Certification and Qualification
9.15.1
FCC Certification and Statement
9.15.2
IC/ISED Certification and Statement
9.16
Module Markings
9.17
End Product Labeling
9.18
Manual Information to the End User
10
Application, Implementation, and Layout
10.1
Application Information
10.1.1
Typical Application Circuit
10.2
Device Connection and Layout Fundamentals
10.2.1
Reset
10.2.2
Unused Pins
10.3
PCB Layout Guidelines
10.3.1
General Layout Recommendations
10.3.2
RF Layout Recommendations
10.3.2.1
Antenna Placement and Routing
10.3.2.2
Transmission Line Considerations
10.4
Reference Designs
11
Environmental Requirements and SMT Specifications
11.1
PCB Bending
11.2
Handling Environment
11.2.1
Terminals
11.2.2
Falling
11.3
Storage Condition
11.3.1
Moisture Barrier Bag Before Opened
11.3.2
Moisture Barrier Bag Open
11.4
PCB Assembly Guide
11.4.1
PCB Land Pattern & Thermal Vias
11.4.2
SMT Assembly Recommendations
11.4.3
PCB Surface Finish Requirements
11.4.4
Solder Stencil
11.4.5
Package Placement
11.4.6
Solder Joint Inspection
11.4.7
Rework and Replacement
11.4.8
Solder Joint Voiding
11.5
Baking Conditions
11.6
Soldering and Reflow Condition
12
Device and Documentation Support
12.1
Device Nomenclature
12.2
Tools and Software
12.2.1
SimpleLink™ Microcontroller Platform
12.3
Documentation Support
12.4
Support Resources
12.5
Trademarks
12.6
Electrostatic Discharge Caution
12.7
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
MOT|48
MPQF581B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
swrs293_oa
swrs293_pm
8.15.3.1
Temperature Sensor
Measured on a Texas Instruments reference design with T
c
= 25 °C, V
DDS
= 3.0 V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Resolution
2
°C
Accuracy
-40 °C to 0 °C
±5.0
°C
Accuracy
0 °C to 105 °C
±3.5
°C
Supply voltage coefficient
(1)
3.6
°C/V
(1)
The temperature sensor is automatically compensated for VDDS variation when using the TI-provided temperature driver.