SWRS210H January   2018  – November 2020 CC1312R

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 861 MHz to 1054 MHz - Receive (RX)
    11. 8.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 8.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 8.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 8.14 359 MHz to 527 MHz - Receive (RX)
    15. 8.15 359 MHz to 527 MHz - Transmit (TX) 
    16. 8.16 359 MHz to 527 MHz - PLL Phase Noise
    17. 8.17 143 MHz to 176 MHz - Receive (RX)
    18. 8.18 143 MHz to 176 MHz  - Transmit (TX) 
    19. 8.19 143 MHz to 176 MHz - PLL Phase Noise
    20. 8.20 Timing and Switching Characteristics
      1. 8.20.1 Reset Timing
      2. 8.20.2 Wakeup Timing
      3. 8.20.3 Clock Specifications
        1. 8.20.3.1 48 MHz Clock Input (TCXO)
        2. 8.20.3.2 48 MHz Crystal Oscillator (XOSC_HF)
        3. 8.20.3.3 48 MHz RC Oscillator (RCOSC_HF)
        4. 8.20.3.4 2 MHz RC Oscillator (RCOSC_MF)
        5. 8.20.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 8.20.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.20.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.20.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       43
      5. 8.20.5 UART
        1. 8.20.5.1 UART Characteristics
    21. 8.21 Peripheral Characteristics
      1. 8.21.1 ADC
        1. 8.21.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.21.2 DAC
        1. 8.21.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.21.3 Temperature and Battery Monitor
        1. 8.21.3.1 Temperature Sensor
        2. 8.21.3.2 Battery Monitor
      4. 8.21.4 Comparators
        1. 8.21.4.1 Low-Power Clocked Comparator
        2. 8.21.4.2 Continuous Time Comparator
      5. 8.21.5 Current Source
        1. 8.21.5.1 Programmable Current Source
      6. 8.21.6 GPIO
        1. 8.21.6.1 GPIO DC Characteristics
    22. 8.22 Typical Characteristics
      1. 8.22.1 MCU Current
      2. 8.22.2 RX Current
      3. 8.22.3 TX Current
      4. 8.22.4 RX Performance
      5. 8.22.5 TX Performance
      6. 8.22.6 ADC Performance
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Proprietary Radio Formats
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  11. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.21.6.1 GPIO DC Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TA = 25 °C, VDDS = 1.8 V
GPIO VOH at 8 mA load IOCURR = 2, high-drive GPIOs only 1.56 V
GPIO VOL at 8 mA load IOCURR = 2, high-drive GPIOs only 0.24 V
GPIO VOH at 4 mA load IOCURR = 1 1.59 V
GPIO VOL at 4 mA load IOCURR = 1 0.21 V
GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 73 µA
GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 19 µA
GPIO low-to-high input transition, with hysteresis IH = 1, transition voltage for input read as 0 → 1 1.08 V
GPIO high-to-low input transition, with hysteresis IH = 1, transition voltage for input read as 1 → 0 0.73 V
GPIO input hysteresis IH = 1, difference between 0 → 1
and 1 → 0 points		 0.35 V
TA = 25 °C, VDDS = 3.0 V
GPIO VOH at 8 mA load IOCURR = 2, high-drive GPIOs only 2.59 V
GPIO VOL at 8 mA load IOCURR = 2, high-drive GPIOs only 0.42 V
GPIO VOH at 4 mA load IOCURR = 1 2.63 V
GPIO VOL at 4 mA load IOCURR = 1 0.40 V
TA = 25 °C, VDDS = 3.8 V
GPIO pullup current Input mode, pullup enabled, Vpad = 0 V 282 µA
GPIO pulldown current Input mode, pulldown enabled, Vpad = VDDS 110 µA
GPIO low-to-high input transition, with hysteresis IH = 1, transition voltage for input read as 0 → 1 1.97 V
GPIO high-to-low input transition, with hysteresis IH = 1, transition voltage for input read as 1 → 0 1.55 V
GPIO input hysteresis IH = 1, difference between 0 → 1
and 1 → 0 points		 0.42 V
TA = 25 °C
VIH Lowest GPIO input voltage reliably interpreted as a High 0.8*VDDS V
VIL Highest GPIO input voltage reliably interpreted as a Low 0.2*VDDS V