SWRS251A May   2021  – November 2021 CC1352P7

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagram – RGZ Package (Top View)
    2. 6.2 Signal Descriptions – RGZ Package
    3. 6.3 Connections for Unused Pins and Modules
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Supply and Modules
    5. 7.5  Power Consumption - Power Modes
    6. 7.6  Power Consumption - Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 861 MHz to 1054 MHz - Receive (RX)
    11. 7.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 7.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 7.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 7.14 Bluetooth Low Energy - Receive (RX)
    15. 7.15 Bluetooth Low Energy - Transmit (TX)
    16. 7.16 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    17. 7.17 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    18. 7.18 Timing and Switching Characteristics
      1. 7.18.1 Reset Timing
      2. 7.18.2 Wakeup Timing
      3. 7.18.3 Clock Specifications
        1. 7.18.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 7.18.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 7.18.3.3 2 MHz RC Oscillator (RCOSC_MF)
        4. 7.18.3.4 32.768 kHz Crystal Oscillator (XOSC_LF)
        5. 7.18.3.5 32 kHz RC Oscillator (RCOSC_LF)
      4. 7.18.4 Synchronous Serial Interface (SSI) Characteristics
        1. 7.18.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       40
      5. 7.18.5 UART
        1. 7.18.5.1 UART Characteristics
    19. 7.19 Peripheral Characteristics
      1. 7.19.1 ADC
        1. 7.19.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.19.2 DAC
        1. 7.19.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.19.3 Temperature and Battery Monitor
        1. 7.19.3.1 Temperature Sensor
        2. 7.19.3.2 Battery Monitor
      4. 7.19.4 Comparators
        1. 7.19.4.1 Low-Power Clocked Comparator
        2. 7.19.4.2 Continuous Time Comparator
      5. 7.19.5 Current Source
        1. 7.19.5.1 Programmable Current Source
      6. 7.19.6 GPIO
        1. 7.19.6.1 GPIO DC Characteristics
    20. 7.20 Typical Characteristics
      1. 7.20.1 MCU Current
      2. 7.20.2 RX Current
      3. 7.20.3 TX Current
      4. 7.20.4 RX Performance
      5. 7.20.5 TX Performance
      6. 7.20.6 ADC Performance
  8. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Proprietary Radio Formats
      2. 8.3.2 Bluetooth 5.2 Low Energy
      3. 8.3.3 802.15.4 (Thread, Zigbee, 6LoWPAN)
    4. 8.4  Memory
    5. 8.5  Sensor Controller
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Serial Peripherals and I/O
    9. 8.9  Battery and Temperature Monitor
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  9. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  10. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 Signal Descriptions – RGZ Package

Table 6-1 Signal Descriptions – RGZ Package
PINI/OTYPEDESCRIPTION
NAMENO.
DCDC_SW33—PowerOutput from internal DC/DC converter(1)
DCOUPL23—PowerFor decoupling of internal 1.27 V regulated digital-supply (2)
DIO_510I/ODigitalGPIO, high-drive capability
DIO_611I/ODigitalGPIO, high-drive capability
DIO_712I/ODigitalGPIO, high-drive capability
DIO_814I/ODigitalGPIO
DIO_915I/ODigitalGPIO
DIO_1016I/ODigitalGPIO
DIO_1117I/ODigitalGPIO
DIO_1218I/ODigitalGPIO
DIO_1319I/ODigitalGPIO
DIO_1420I/ODigitalGPIO
DIO_1521I/ODigitalGPIO
DIO_1626I/ODigitalGPIO, JTAG_TDO, high-drive capability
DIO_1727I/ODigitalGPIO, JTAG_TDI, high-drive capability
DIO_1828I/ODigitalGPIO
DIO_1929I/ODigitalGPIO
DIO_2030I/ODigitalGPIO
DIO_2131I/ODigitalGPIO
DIO_2232I/ODigitalGPIO
DIO_2336I/ODigital or AnalogGPIO, analog capability
DIO_2437I/ODigital or AnalogGPIO, analog capability
DIO_2538I/ODigital or AnalogGPIO, analog capability
DIO_2639I/ODigital or AnalogGPIO, analog capability
DIO_2740I/ODigital or AnalogGPIO, analog capability
DIO_2841I/ODigital or AnalogGPIO, analog capability
DIO_2942I/ODigital or AnalogGPIO, analog capability
DIO_3043I/ODigital or AnalogGPIO, analog capability
EGP——GNDGround – exposed ground pad(3)
JTAG_TMSC24I/ODigitalJTAG TMSC, high-drive capability
JTAG_TCKC25IDigitalJTAG TCKC
RESET_N35IDigitalReset, active low. No internal pullup resistor
RF_P_2_4GHZ1—RFPositive 2.4-GHz RF input signal to LNA during RX
Positive 2.4-GHz RF output signal from PA during TX
RF_N_2_4GHZ2—RFNegative 2.4-GHz RF input signal to LNA during RX
Negative 2.4-GHz RF output signal from PA during TX
RF_P_SUB_1GHZ3—RFPositive Sub-1 GHz RF input signal to LNA during RX
Positive Sub-1 GHz RF output signal from PA during TX
RF_N_SUB_1GHZ4—RFNegative Sub-1 GHz RF input signal to LNA during RX
Negative Sub-1 GHz RF output signal from PA during TX
RX_TX7—RFOptional bias pin for the RF LNA
TX_20DBM_P5—RFPositive Sub-1 GHz or 2.4-GHz high-power TX signal
TX_20DBM_N6—RFNegative Sub-1 GHz or 2.4-GHz high-power TX signal
VDDR45—PowerInternal supply, must be powered from the internal DC/DC converter or the internal LDO(2)(4)(6)
VDDR_RF48—PowerInternal supply, must be powered from the internal DC/DC converter or the internal LDO(2)(5)(6)
VDDS44—Power1.8-V to 3.8-V main chip supply(1)
VDDS213—Power1.8-V to 3.8-V DIO supply(1)
VDDS322—Power1.8-V to 3.8-V DIO supply(1)
VDDS_DCDC34—Power1.8-V to 3.8-V DC/DC converter supply
X48M_N46—Analog48-MHz crystal oscillator pin 1
X48M_P47—Analog48-MHz crystal oscillator pin 2
X32K_Q18—Analog32-kHz crystal oscillator pin 1
X32K_Q29—Analog32-kHz crystal oscillator pin 2
(1) For more details, see technical reference manual listed in Section 10.3.
(2) Do not supply external circuitry from this pin.
(3) EGP is the only ground connection for the device. Good electrical connection to device ground on printed circuit board (PCB) is imperative for proper device operation.
(4) If internal DC/DC converter is not used, this pin is supplied internally from the main LDO.
(5) If internal DC/DC converter is not used, this pin must be connected to VDDR for supply from the main LDO.
(6) Output from internal DC/DC and LDO is trimmed to 1.68 V.