SWRS196I January   2018  – February 2021 CC1352R

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Functional Block Diagram
  5. 5 Revision History
  6. 6 Device Comparison
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 861 MHz to 1054 MHz - Receive (RX)
    11. 8.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 8.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 8.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 8.14 359 MHz to 527 MHz - Receive (RX)
    15. 8.15 359 MHz to 527 MHz - Transmit (TX) 
    16. 8.16 359 MHz to 527 MHz - PLL Phase Noise
    17. 8.17 143 MHz to 176 MHz - Receive (RX)
    18. 8.18 143 MHz to 176 MHz  - Transmit (TX) 
    19. 8.19 143 MHz to 176 MHz - PLL Phase Noise
    20. 8.20 Bluetooth Low Energy - Receive (RX)
    21. 8.21 Bluetooth Low Energy - Transmit (TX)
    22. 8.22 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    23. 8.23 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    24. 8.24 Timing and Switching Characteristics
      1. 8.24.1 Reset Timing
      2. 8.24.2 Wakeup Timing
      3. 8.24.3 Clock Specifications
        1. 8.24.3.1 48 MHz Clock Input (TCXO)
        2. 8.24.3.2 48 MHz Crystal Oscillator (XOSC_HF)
        3. 8.24.3.3 48 MHz RC Oscillator (RCOSC_HF)
        4. 8.24.3.4 2 MHz RC Oscillator (RCOSC_MF)
        5. 8.24.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 8.24.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.24.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.24.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       47
      5. 8.24.5 UART
        1. 8.24.5.1 UART Characteristics
    25. 8.25 Peripheral Characteristics
      1. 8.25.1 ADC
        1. 8.25.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.25.2 DAC
        1. 8.25.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.25.3 Temperature and Battery Monitor
        1. 8.25.3.1 Temperature Sensor
        2. 8.25.3.2 Battery Monitor
      4. 8.25.4 Comparators
        1. 8.25.4.1 Low-Power Clocked Comparator
        2. 8.25.4.2 Continuous Time Comparator
      5. 8.25.5 Current Source
        1. 8.25.5.1 Programmable Current Source
      6. 8.25.6 GPIO
        1. 8.25.6.1 GPIO DC Characteristics
    26. 8.26 Typical Characteristics
      1. 8.26.1 MCU Current
      2. 8.26.2 RX Current
      3. 8.26.3 TX Current
      4. 8.26.4 RX Performance
      5. 8.26.5 TX Performance
      6. 8.26.6 ADC Performance
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Proprietary Radio Formats
      2. 9.3.2 Bluetooth 5.2 Low Energy
      3. 9.3.3 802.15.4 (Thread, Zigbee, 6LoWPAN)
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
    2. 10.2 Junction Temperature Calculation
  11. 11Device and Documentation Support
    1. 11.1 Tools and Software
      1. 11.1.1 SimpleLink™ Microcontroller Platform
    2. 11.2 Documentation Support
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.24.2 Wakeup Timing

Measured over operating free-air temperature with VDDS = 3.0 V (unless otherwise noted). The times listed here do not include software overhead.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
MCU, Reset to Active(1) 850 - 3000 µs
MCU, Shutdown to Active(1) 850 - 3000 µs
MCU, Standby to Active 160 µs
MCU, Active to Standby 36 µs
MCU, Idle to Active 14 µs
(1) The wakeup time is dependent on remaining charge on VDDR capacitor when starting the device, and thus how long the device has been in Reset or Shutdown before starting up again. The wake up time increases with a higher capacitor value.